Light-Emitting Module Backboard Structure for Faster Heat Dissipation
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Solution Overview
Problem
The existing backlight modules in liquid crystal displays face poor heat dissipation efficiency due to the use of a back adhesive layer, which affects the performance of the lamp panel.
Innovation Solution
A light-emitting module is designed with a carrier substrate, a first light-emitting circuit layer, a backboard, and a connection member, where the backboard is directly connected to the carrier substrate through a mounting cavity, eliminating the need for a back adhesive layer and enhancing heat dissipation by allowing direct heat transfer to external air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a back adhesive layer is used to connect the backboard to the carrier substrate, then the structural integrity is maintained, but the heat dissipation efficiency deteriorates due to the additional thermal resistance
Solution Approach 1:
The patent removes the back adhesive layer from the structure, eliminating the thermal resistance it introduces. The backboard is directly connected to the carrier substrate through mounting cavities, allowing heat to transfer directly from the LED lights through the carrier substrate to the backboard without passing through the adhesive layer, thus improving heat dissipation efficiency
Solution Approach 2:
The mounting cavity structure merges the connection function and heat dissipation function into a single integrated design. The cavity walls provide both mechanical support and thermal conduction pathways, combining structural integrity with improved thermal management in one element
2Temperature
If the heat transfer path is lengthened through multiple layers including adhesive, then structural flexibility is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The adhesive layer is extracted from the heat transfer path, shortening the thermal conduction distance from multiple layers to direct contact between the carrier substrate and backboard. This eliminates the thermal bottleneck created by the adhesive while the mounting cavity structure maintains structural integrity
Solution Approach 2:
The mounting cavity introduces a vertical dimension for heat dissipation by creating direct thermal pathways through the cavity walls. Heat can transfer vertically from the LED through the carrier substrate bottom to the backboard, adding a new heat escape route that bypasses the adhesive layer
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency by shortening the heat transfer path and maintaining a compact structure, resulting in lower temperatures and better performance of the lamp panel.
Implementation Method 1
enhancing heat dissipation by allowing direct heat transfer to external air
Data Source
AI summary
A light-emitting module includes a carrier substrate, a first light-emitting circuit layer, a backboard, a mounting cavity and at least one connection member. The first light-emitting circuit layer is disposed on the carrier substrate. The backboard is disposed on a side of the carrier substrate away from the first light-emitting circuit layer and is in contact with the carrier substrate. The mounting cavity is disposed in at least one of the backboard and the carrier substrate, and an inner wall of the mounting cavity is enclosed by both the backboard and the carrier substrate. A connection member is disposed in the mounting cavity and fixedly connected to the carrier substrate and the backboard.