Vehicle Light Module Heat Sink Routing Conductors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for laying electrical lines in motor vehicle lighting devices are complex, costly, and lack effective electromagnetic compatibility, particularly due to the need for expensive metal shielding which restricts flexibility and increases rigidity.
Innovation Solution
Routed electrical lines through a heat sink with good thermal and interference shielding properties, eliminating the need for separate metal shielding by utilizing the heat sink for both heat dissipation and electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal shielding is used to shield electrical lines against electromagnetic interference, then electromagnetic compatibility is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the heat dissipation function and electromagnetic shielding function into a single heat sink structure. The heat sink integrates internal cavities that accommodate electrical lines while providing both thermal management and electromagnetic interference shielding, eliminating the need for separate shielding components.
Solution Approach 2:
The heat sink is designed to perform multiple functions simultaneously: dissipating heat from LED modules, shielding electrical lines from electromagnetic interference, and providing structural support. This multi-functional design reduces overall device complexity while maintaining electromagnetic compatibility.
2Reliability
If metal shielding is used to shield electrical lines, then electromagnetic compatibility is improved, but manufacturing cost increases
Solution Approach 1:
The heat sink combines heat dissipation and electromagnetic shielding functions into a single integrated component, eliminating the need for separate metal shielding materials and reducing manufacturing steps. This integration lowers material costs and simplifies the production process.
Solution Approach 2:
The heat sink serves multiple purposes including heat dissipation, electromagnetic shielding, and structural support, replacing what would traditionally require multiple separate components. This multi-functionality reduces overall manufacturing cost while maintaining electromagnetic compatibility.
3Reliability
If metal shielding is used to shield electrical lines, then electromagnetic compatibility is improved, but ease of operation deteriorates due to restricted flexibility
Solution Approach 1:
The heat sink integrates electromagnetic shielding functionality into its internal structure with built-in cavities that accommodate electrical lines. This integration allows lines to be routed freely within the shielding structure without being constrained by external shielding materials, maintaining flexibility while providing electromagnetic compatibility.
4Reliability
If metal shielding is used to shield electrical lines, then electromagnetic compatibility is improved, but device complexity increases due to additional grounding steps
Solution Approach 1:
The heat sink combines heat dissipation and electromagnetic shielding functions into a single integrated structure, eliminating the need for separate shielding components and their associated grounding procedures. This reduces device complexity while maintaining electromagnetic compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the laying of electrical lines, reduces costs, and enhances electromagnetic compatibility while maintaining effective shielding, allowing for flexible line placement and reduced rigidity.
Implementation Method 1
the semiconductor light source being arranged in a thermal connection to the heat sink
Implementation Method 2
the heat sink have very good interference shielding properties due to its material properties
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
The invention relates to a light module (10) for a lighting device (1) of a motor vehicle. The light module (10) comprises a semiconductor light source (11) and a heat sink (13), wherein the semiconductor light source (11) is arranged in thermal connection to the heat sink (13). Furthermore, the light module (10) comprises an electrical conductor (16) for supplying power and/or controlling any electrical or electronic components of the lighting device (1). In order to shield the electrical conductors (16) as simply, quickly, and efficiently as possible, it is proposed that at least a portion of the conductor (16) runs through at least a portion of the heat sink (13).