Light-Emitting Module Bonding Structure for Clear Optical Paths
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Solution Overview
Problem
In the manufacturing of light-emitting devices, the adhesive used to bond optical members can obstruct the optical path of light, and as devices are miniaturized, the available space for adhesive placement becomes limited, posing challenges in maintaining optical efficiency and device compactness.
Innovation Solution
The proposed solution involves a light-emitting device structure that includes a package, a light-emitting element, a spacer, and an optical member, where the adhesive is strategically applied between the package's lid body and the optical member, with spacers positioned to minimize adhesive interference with the optical path, allowing for compact design and efficient light transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive is applied to bond the optical member to the package, then bonding strength is improved, but the adhesive obstructs the optical path of light
Solution Approach 1:
The bonding area is segmented into two distinct regions: a first bonding portion that bonds the lid body to the optical member, and a second bonding portion that bonds the spacer to the optical member. This segmentation allows the adhesive to be distributed in a way that maintains bonding strength while minimizing optical path obstruction.
Solution Approach 2:
The adhesive is applied with different characteristics in different locations: in the first bonding portion, the adhesive forms a thinner layer optimized for bonding without excessive light obstruction, while in the second bonding portion, the adhesive provides structural support. This local differentiation resolves the contradiction between bonding strength and optical transparency.
2Volume of moving object
If the light-emitting device is reduced in size, then device compactness is improved, but the region where adhesive can be provided becomes limited
Solution Approach 1:
The invention transitions from a single-plane bonding approach to a multi-dimensional bonding structure by introducing vertical layering. The first bonding portion is positioned at a first height from the lid body, while the second bonding portion is positioned at a second height, creating a three-dimensional bonding arrangement that accommodates compact device design while providing sufficient adhesive application regions.
3Strength
If adhesive is applied between lid body and optical member, then bonding is achieved, but adhesive placement must be precisely controlled to avoid optical path obstruction
Solution Approach 1:
The spacer acts as an intermediary element that facilitates precise adhesive placement. By bonding the spacer to the optical member in the second bonding portion, the invention creates a reference structure that guides adhesive application, thereby reducing the precision requirements for direct adhesive placement between the lid body and optical member while still achieving reliable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses adhesive obstruction of the optical path, enabling the creation of compact light-emitting devices with improved optical efficiency by carefully managing the adhesive placement and spacer positioning.
Implementation Method 1
The first bonding portion bonds the lid body and the optical member
Data Source
AI summary
A light-emitting device includes a package, a light-emitting element, a first spacer, an optical member, and a first bonding portion. The package includes a lid body having an upper surface. The light-emitting element is disposed in an internal space of the package. The first spacer is disposed on the upper surface of the lid body and has an upper surface. The optical member is disposed above the lid body and has an upper surface and a lower surface. The first bonding portion bonds the lid body and the optical member. The first bonding portion is arranged between the upper surface of the lid body and the lower surface of the optical member and between the upper surface of the first spacer and the lower surface of the optical member.