Light Emitting Module Assembly With Resist-Layer Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production efficiency of light emitting modules with multiple semiconductor elements mounted on a single wiring board needs to be improved.
Innovation Solution
A method involving an intermediate structure with a wiring board, metal layers, conducting members, and a resist layer is used, where the light emitting element is positioned with electrodes facing the conducting members, and bonding members are formed to connect them, with the resist layer being removed to enhance assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional mounting methods are used for light emitting elements on wiring boards, then the basic assembly can be completed, but the production efficiency needs to be further improved
Solution Approach 1:
The resist layer is formed with openings at predetermined positions before the light emitting element is mounted. This preliminary preparation of the resist layer enables subsequent bonding members to be formed only at specific locations, streamlining the assembly process and improving production efficiency without increasing overall manufacturing complexity
Solution Approach 2:
A resist layer is introduced as an intermediary material between the wiring board and the light emitting element. This resist layer serves as a temporary structure that facilitates precise positioning and bonding member formation, and is removed after serving its purpose, thereby enabling more efficient manufacturing
2Reliability
If bonding members are formed to connect light emitting elements to conducting members, then electrical connectivity is achieved, but shape variation and positioning stability need to be controlled
Solution Approach 1:
The resist layer acts as a mediator that defines precise boundaries for bonding member formation. By pre-forming openings in the resist layer at exact positions, the bonding members are constrained to grow only where needed, ensuring both reliable electrical connectivity and consistent positioning without excessive shape variation
Solution Approach 2:
The resist layer is designed with local openings at specific positions rather than being uniform throughout. This local quality approach ensures that bonding members are formed only at the necessary locations with precise dimensional control, achieving both connectivity reliability and positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for improved production efficiency and reliability of light emitting modules by stabilizing the positioning of light emitting elements and facilitating efficient bonding member growth, reducing shape variation and connectivity issues.
Implementation Method 1
forming a first bonding member on the first conducting member to be in contact with the first conducting member and the first electrode
Data Source
AI summary
A method of manufacturing a light emitting module includes: providing an intermediate structure that includes a wiring board having an upper surface and including a metal layer, a first conducting member on the metal layer, and a second conducting member on the metal layer; disposing, on the intermediate structure, a resist layer having openings; providing a light emitting element including a first electrode and a second electrode, and disposing the light emitting element on the resist layer such that the first electrode and the second electrode respectively face the first conducting member and the second conducting member while a portion of an outer periphery of the lower surface of the light emitting element is exposed from the resist layer in the openings; forming a first bonding member on the first conducting member and forming a second bonding member on the second conducting member; and removing the resist layer.