Light Module Substrate Segmentation for Cost Reduction
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Solution Overview
Problem
The increasing labor and material costs, along with competitive pressures, have made it challenging to maintain profitability in the illumination industry, particularly due to the high costs associated with double-layer circuit boards used for integrating lamp panels and power supply boards, which also lead to inefficient use of substrate area and additional assembly costs.
Innovation Solution
A method of fabricating a light module by separating a prefabricated substrate into regions to form a first and second substrate, allowing for the integration of light emitting elements and drive elements on one substrate and the power supply on another, using a single-layer circuit board to reduce material and assembly costs, and enabling efficient utilization of substrate area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a double-layer circuit board is used to integrate lamp panel and power supply board, then integration is achieved, but manufacturing cost increases significantly
Solution Approach 1:
The circuit board is divided into two functional regions: a first region for mounting light emitting elements and a second region for mounting power supply components. This segmentation allows both functions to coexist on a single-layer board without requiring expensive double-layer construction, thereby reducing manufacturing cost while maintaining integration.
Solution Approach 2:
The patent utilizes the z-dimension (vertical space) by allowing power supply components to protrude from the board surface. This enables component placement in three-dimensional space rather than being constrained to two-dimensional plane, effectively solving the space conflict between light emitting elements and power supply components on a single-layer board.
2Adaptability or versatility
If power supply components are placed on the back surface of the circuit board, then integration is improved, but only SMT type components can be accommodated due to narrow clearance
Solution Approach 1:
The patent transitions from two-dimensional component placement (constrained to board surface) to three-dimensional placement by allowing power supply components to extend vertically from the board. This enables the use of DIP type components with larger heights on the back surface while maintaining narrow clearance, thereby increasing component type flexibility without adding board complexity.
3Ease of manufacture
If single-layer circuit board is used separately for power supply board and lamp panel, then manufacturing cost is reduced, but additional assembly processes and lower substrate utilization rate increase overall cost
Solution Approach 1:
The patent merges the power supply board and lamp panel into a single integrated circuit board structure. The board contains both a first region for light emitting elements and a second region for power supply components, eliminating the need for separate boards and additional assembly processes. This integration maintains the cost benefits of single-layer construction while improving assembly efficiency and substrate utilization.
4Power
If the circuit board area is increased to meet higher luminance and power demands, then performance is improved, but the cost of double-layer circuit board increases significantly
Solution Approach 1:
The circuit board is segmented into distinct functional regions that can be independently optimized. The first region accommodates light emitting elements arranged in series/parallel configurations to meet luminance requirements, while the second region houses power supply components scaled to meet power demands. This segmentation allows the board area to be efficiently utilized without the exponential cost increase associated with double-layer construction.
Data Source
AI summary
A light module and a manufacturing method are provided. The light module comprises a first and a second substrate separated from a prefabricated substrate along a closed curve, the first substrate is detachable connected and/or fixed with the second substrate; light emitting elements mounted on one of the first and second substrate; and a drive element mounted on the other one of the first and second substrate. The method comprises: determining a closed curve on a prefabricated substrate to separate the prefabricated substrate into a first region and a second region; providing light emitting elements and first electronic element on first surface of the prefabricated substrate; providing second electronic element on second surface of the prefabricated substrate; separating a first and second substrate from the prefabricated substrate along the closed curve; and assembling and connecting the second substrate with the first substrate at a separation opening.