Light Emitting Module Layout for Thermistor Light Shielding

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Solution Overview

Problem

Existing light emitting modules do not effectively protect components such as thermistors from external light and other environmental influences, necessitating a design that can easily provide protection for components within the module.

Innovation Solution

A substrate module with a specific configuration that includes a substrate, power receiving devices, a protected component, and connection components, where the protected component is positioned between the power receiving devices and the connection components, and a protection portion is provided to shield the protected component from external influences like light and heat.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the thermistor is disposed outside the light emitting device, then it is easier to access and measure temperature, but it becomes vulnerable to external light interference

Engineering Contradiction:
Improvetemperature measurement accessibilityVSAvoidexternal light interference
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a light-shielding member as an intermediary element between the external light source and the thermistor. This mediator blocks harmful light from reaching the thermistor while allowing the thermistor to remain positioned outside the light emitting device for easy temperature measurement and monitoring.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a protection structure is added to shield components from external factors, then component reliability improves, but module complexity increases

Engineering Contradiction:
Improvecomponent protection from external factorsVSAvoidmodule structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The light-shielding member is strategically positioned only where needed - specifically to protect the thermistor from external light - rather than providing comprehensive shielding for the entire module. This localized approach protects vulnerable components while minimizing the addition of structural complexity to the overall module design.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The module effectively protects the target components from external factors, ensuring their operational integrity by positioning the protection portion strategically to cover the protected component without interfering with the power receiving devices, thus maintaining module functionality.

Implementation Method 1

a protection portion is provided to shield the protected component from external influences like light and heat

Methodology Applied
Scientific EffectLight blocking: Absorption (EM radiation)

Data Source

PatentUS20240414846A1Substrate module or light emitting module
Publication Date: 2024.12.12 NICHIA CORP
  • US20240414846A1 patent drawing
  • US20240414846A1 patent drawing
  • US20240414846A1 patent drawing

AI summary

A light emitting module includes: a substrate having a top surface and a bottom surface and including, at the top surface, a plurality of wiring regions; one or more light emitting devices, each light emitting device including a plurality of semiconductor laser elements, and a package in which the plurality of semiconductor laser elements is disposed, and each light emitting device being configured to emit light upward; and a first connection component including a first connection portion. The plurality of wiring regions include a plurality of a first wiring regions, a plurality of second wiring regions that are electrically connected to the plurality of first wiring regions, one or more third wiring regions, and one or more fourth wiring regions. The one or more light emitting devices are disposed on the plurality of first wiring regions. The first connection component is disposed on the plurality of second wiring regions.