Light-Emitting Module Assembly With Exposed Wire-Connection Layout
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices and modules are complex and inefficient in establishing electrical connections between light sources and mounting members, requiring wire bonding and resin coverage which can be cumbersome.
Innovation Solution
A method involving a light source with a support substrate, light-emitting parts, a resin member, and a light-shielding member, along with a control unit and wire connection, where the resin member and light-shielding member are strategically positioned to expose wire-connection parts and emission faces, facilitating easier electrical connections and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding technique is used to electrically connect light source and mounting member, then electrical connection is established, but the connection process becomes complex and cumbersome
Solution Approach 1:
The support substrate is divided into distinct functional regions: a light-emitting part arrangement region for mounting light-emitting parts, and a wire-connection part arrangement region for electrical connections. This segmentation allows wire-connection parts to be strategically positioned away from light-emitting parts, simplifying the wiring process and reducing complexity while maintaining reliable electrical connections.
Solution Approach 2:
The patent utilizes the vertical dimension by arranging wire-connection parts on the reverse surface of the support substrate relative to the light-emitting parts. This three-dimensional arrangement separates electrical connection functions from light emission functions in space, eliminating the need for complex planar wiring and significantly simplifying the connection process.
2Reliability
If resin material is used to cover wires for protection, then wire protection is improved, but the assembly process becomes more cumbersome
Solution Approach 1:
The support substrate is designed with pre-integrated wire-connection parts that are positioned and prepared in advance on the reverse surface. This preliminary arrangement of connection terminals eliminates the need for complex post-assembly wire routing and resin covering operations, significantly simplifying the manufacturing process while ensuring reliable wire connections.
3Volume of moving object
If wire-connection parts are positioned close to light-emitting parts, then device size is reduced, but wire routing becomes complex and light emission is affected
Solution Approach 1:
The patent resolves the conflict between compact size and wire routing complexity by utilizing the vertical dimension. Wire-connection parts are positioned on the reverse surface of the support substrate, directly opposite or adjacent to light-emitting parts in the planar view but separated in the vertical dimension. This allows for simple, short wire connections without interfering with light emission paths, achieving both compact size and routing simplicity.
4Reliability
If conventional encapsulation is used with sealing member inward of walls, then light-emitting element is protected, but the structure becomes complex
Solution Approach 1:
The support substrate serves multiple functions simultaneously: it provides mechanical support for light-emitting parts, integrates wire-connection terminals for electrical connections, and acts as a mounting platform. This multi-functional integration eliminates the need for separate encapsulation structures with inward-disposed sealing members, simplifying the overall device structure while maintaining protection and connection functions.
Data Source
AI summary
A method of manufacturing a light-emitting device includes: preparing a light source, which includes: (a) preparing a structure including: a support substrate having a first upper face and including, on the first upper face, a plurality of first terminal parts disposed in the light-emitting part arrangement region, and one or more first wire-connection parts, and a plurality of light-emitting parts disposed in the light-emitting part arrangement region and electrically connected to the first terminal parts, each of the plurality of light-emitting parts having an emission face, (b) disposing a resin member on the first upper face between the light-emitting part arrangement region and the one or more first wire-connection parts in a top view, and (c) disposing a light-shielding member in contact with the resin member while the first wire-connection parts and the emission faces of the light-emitting parts are exposed from the light-shielding member in the top view.