Light-Emitting Module Wiring Layout for Precise Miniaturization
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Solution Overview
Problem
Existing light-emitting devices require high placement precision for downsizing, which is challenging due to the complexity of wiring formation.
Innovation Solution
A method for manufacturing a light-emitting module involves placing a light-emitting element on a support member with electrode formation surface facing upward, forming conductive members, and using reflective resin layers to facilitate wiring electrode formation, allowing for the removal of the support member and achieving downsizing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wiring is formed directly on substrate for downsizing, then device size is reduced, but placement precision requirement increases
Solution Approach 1:
The patent divides the wiring formation process into multiple stages: first forming element electrodes on the light-emitting element, then forming conductive members on the substrate, and finally connecting them through alignment. This segmentation allows each stage to be optimized independently, reducing the overall precision requirement compared to direct wiring formation on substrate.
Solution Approach 2:
The light-emitting element is prepared in advance with its electrode formation surface containing element electrodes already formed. This preliminary preparation allows the element to be handled and positioned more easily, as the critical wiring connections are established in a controlled manner during assembly rather than requiring high-precision direct placement on substrate.
2Volume of moving object
If complex wiring structure is used for downsizing, then device size is reduced, but device complexity increases
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support, carries the conductive members for electrical connection, and acts as a platform for alignment. The light-emitting element's electrode formation surface also serves dual purposes by containing both the element electrodes for electrical connection and the alignment marks for positioning. This multi-functionality reduces the need for additional specialized components, simplifying the overall wiring structure.
Solution Approach 2:
The patent combines the alignment mark function with the electrode formation surface of the light-emitting element, rather than requiring separate alignment features. The conductive members are formed to overlap with both the element electrodes and the alignment marks, merging the electrical connection function with the alignment function into a single integrated process step.
Data Source
AI summary
A method for manufacturing a light-emitting module, includes placing a light-emitting element on a support member with an electrode formation surface of the light-emitting element facing upward; forming a pair of first conductive members respectively on the element electrodes; forming a first light-reflective resin layer on the support member and around the light-emitting element and the first conductive members; forming a pair of second conductive members on the first light-reflective resin layer and respectively on the first conductive members, the second conductive member being wider than the first conductive member; forming a second light-reflective resin layer on the first light-reflective resin layer and around the second conductive members; forming wiring electrodes over the second light-reflective resin layer from the second conductive members; and removing the support member.