Light-Patterned Dicing Tape for Chip Fly-Off and Burr Control
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Solution Overview
Problem
Existing dicing methods using conventional dicing tapes face issues such as chip fly-off at the outermost peripheral portion of the work, leading to blade breakage and difficulty in picking up semiconductor devices due to burrs, especially when dicing non-rectangular semiconductor substrates.
Innovation Solution
A dicing tape with a base and adhesive that undergoes a light-activated curing reaction, featuring a releasing film to create areas of varying adhesive strength, allowing secure fixation of the work piece during dicing to prevent chip fly-off and burr formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dicing tape with uniform adhesive is used, then the work piece can be fixed on the ring frame, but chip fly-off occurs at the outermost peripheral portion leading to blade breakage
Solution Approach 1:
The adhesive is divided into different regions with different adhesive strengths: a first adhesive region with lower adhesive strength and a second adhesive region with higher adhesive strength. This local differentiation prevents chip fly-off at the peripheral portion while maintaining reliable fixation, resolving the contradiction between fixation stability and chip fly-off prevention.
Solution Approach 2:
The adhesive is segmented into multiple functional regions (first adhesive region and second adhesive region) with different properties. The first adhesive region provides gentle fixation to prevent chip fly-off, while the second adhesive region provides strong fixation for reliable work piece attachment, thus resolving the contradiction.
2Reliability
If conventional dicing tape with uniform adhesive is used, then the work piece can be attached securely, but burrs are formed making device pickup difficult
Solution Approach 1:
The adhesive strength is locally optimized: the first adhesive region with lower adhesive strength prevents excessive stress concentration that causes burr formation, while the second adhesive region with higher adhesive strength ensures secure attachment. This resolves the contradiction between attachment security and surface quality.
Solution Approach 2:
The releasing film is peeled in advance to expose the first adhesive region before dicing, preparing the surface to prevent burr formation during the cutting process. This preliminary action ensures both secure attachment and burr-free surfaces.
3Strength
If releasing film is completely removed, then adhesive strength is maximized for secure fixation, but chip fly-off occurs at peripheral portions
Solution Approach 1:
Instead of uniformly maximizing adhesive strength, the adhesive is designed with different strengths in different regions. The first adhesive region maintains lower strength to prevent chip fly-off, while the second adhesive region provides high strength for secure fixation, resolving the contradiction between strength and chip fly-off prevention.
Solution Approach 2:
The adhesive is segmented into functional regions with different strengths. The first adhesive region (lower strength) prevents chip fly-off at peripheral portions, while the second adhesive region (higher strength) provides secure fixation, thus resolving the contradiction.
4Strength
If adhesive strength is uniformly high, then work piece fixation is secure, but burr formation occurs during dicing
Solution Approach 1:
The adhesive strength is locally optimized rather than uniformly high. The first adhesive region has lower strength to prevent burr formation during dicing, while the second adhesive region has higher strength to ensure secure work piece fixation, resolving the contradiction between fixation security and surface quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures high-quality semiconductor device production by suppressing chip fly-off and burr formation, facilitating easy pickup of semiconductor devices while maintaining adhesive integrity.
Implementation Method 1
an adhesive provided on an upper surface of the base and including a material capable of changing in property by light irradiation
Data Source
AI summary
According to one embodiment, a manufacturing method of a semiconductor device, comprising: attaching a dicing tape to a ring frame, the dicing tape including a base, an adhesive provided on an upper surface of the base and including a material capable of changing in property by light irradiation, and a releasing film; executing light irradiation from below the base, thereby making an adhesivity of a first portion overlapping the releasing film, in an upper surface of the adhesive, different from an adhesivity of a second portion not overlapping the first portion, in the upper surface of the adhesive; attaching a work piece to the adhesive; and singulating a plurality of semiconductor devices by dicing the work piece.