Hollow-Core Light Pipe Tilt Measurement for Semiconductor Alignment
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Solution Overview
Problem
Existing methods for measuring misalignment between conductive pillars and contacts in semiconductor manufacturing are either inaccurate or destructive, and take a long time, leading to inefficiencies and waste.
Innovation Solution
A non-destructive measurement technique using a hollow core light pipe is employed to measure misalignment by forming a set of cavities with optical properties, allowing light to be channeled through to assess the alignment between contacts and conductive pillars.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing measurement methods are used to measure misalignment between conductive pillars and contacts, then measurement can be performed, but the measurement is either inaccurate or destructive and takes a long time
Solution Approach 1:
The patent introduces an intermediary measurement marker structure consisting of a first marker portion and a second marker portion with a known spatial relationship. This intermediary structure mediates between the measurement system and the actual misalignment measurement, enabling accurate and rapid indirect measurement without direct interference with the conductive pillars or contacts
Solution Approach 2:
The patent creates optical copies or images of the marker portions through imaging. By capturing images of the first and second marker portions and analyzing their relative positions in the image space, the system can determine misalignment without physically touching or disturbing the actual structures, enabling rapid non-destructive measurement
2Measurement precision
If existing measurement methods are used, then misalignment can be measured, but the process is destructive to the semiconductor structure
Solution Approach 1:
The measurement marker acts as an intermediary that absorbs the measurement process, protecting the actual semiconductor structures. By measuring the positions of the marker portions rather than directly measuring the conductive pillars and contacts, the harmful measurement effects are isolated to the marker structure only
Solution Approach 2:
The patent uses optical imaging to create copies of the marker portions for measurement analysis. This non-contact optical copying method eliminates physical interference with the semiconductor structures, making the measurement process completely non-destructive
3Measurement precision
If existing measurement methods are used, then misalignment measurement can be performed, but production efficiency is reduced due to long measurement time
Solution Approach 1:
The measurement marker structure is prepared in advance during the manufacturing process, with the first and second marker portions formed at predetermined positions. This preliminary setup eliminates the need for complex real-time measurement preparations, enabling rapid direct measurement and improving production efficiency
Solution Approach 2:
The optical imaging and image processing approach allows for extremely rapid measurement by capturing images and calculating relative positions computationally. This copying and analysis method is much faster than traditional physical measurement techniques, significantly improving manufacturing throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and rapid assessment of misalignment, reducing waste and production time, and improving manufacturing efficiency.
Implementation Method 1
A non-destructive measurement technique using a hollow core light pipe is employed to measure misalignment by forming a set of cavities with optical properties, allowing light to be channeled through to assess the alignment between contacts and conductive pillars
Data Source
AI summary
Methods, systems, and devices for measuring tilt in semiconductor manufacturing are described. A first set of contacts and a second set of contacts may be formed on the measurement marker. Based on forming the sets of contacts, a stack of nitride and oxide materials may be deposited over the first set of contacts. Subsequently, a set of cavities may be etched through the stack of nitride and oxide materials to the set of contacts, such that a respective cavity may be etched to the set of contacts. The set of cavities may form a hollow-core light pipe that may be used for measurements over a range of optical frequencies. As such, a light may be emitted through the set of cavities, where a measurement may be obtained at the interface between the set of contacts and the set of cavities based on the emitted light.