Light Pipe Window Structure for Semiconductor Thermal Processing
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Solution Overview
Problem
Existing thermal processing techniques for semiconductor substrates face challenges in controlling the temperature of lampheads due to high intensity lamps, which complicates the cooling process and affects the precision of thermal treatments.
Innovation Solution
A light pipe window structure is introduced, comprising a transparent plate with aligned light pipe structures that transmit radiant heat from energy sources outside the process chamber, allowing for improved temperature control and efficient energy transfer to the substrate while maintaining the lamphead outside the chamber for enhanced cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high intensity lamps are used in the lamphead to rapidly heat the substrate, then heating efficiency is improved, but temperature control of the lamphead becomes difficult
Solution Approach 1:
The lamphead assembly is extracted from the process chamber, separating the heat source from the processing environment. This allows the high intensity lamps to operate at high temperatures without interfering with the controlled thermal environment needed for substrate processing, resolving the temperature control difficulty while maintaining heating efficiency
Solution Approach 2:
A transparent window structure with light pipe structures acts as an intermediary between the lamphead assembly and the substrate. The light pipes transmit radiant energy through the transparent window to heat the substrate, enabling efficient energy transfer while isolating the lamphead from the process chamber temperature control requirements
2Power
If the lamphead is positioned closer to the substrate to improve heating efficiency, then energy transfer is enhanced, but the lamphead cannot be effectively cooled
Solution Approach 1:
The lamphead assembly is positioned outside the process chamber and extracted from the confined space near the substrate. This separation allows adequate space for cooling mechanisms to be implemented around the lamphead without interfering with substrate processing, while the transparent window maintains efficient radiant energy transfer
Solution Approach 2:
The transparent window with light pipe structures serves as an intermediary that enables close coupling between the lamphead and substrate for efficient energy transfer, while simultaneously providing a barrier that allows independent thermal management of the lamphead assembly through cooling channels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the distance between energy sources and the substrate, improving heating efficiency and allowing for precise temperature control, thus enhancing the thermal processing of semiconductor substrates.
Implementation Method 1
a light pipe window structure for use in a thermal process chamber... a plurality of light pipe structures formed in a transparent material... having a longitudinal axis disposed in a substantially perpendicular relation to a plane defined by a surface of the transparent plate
Implementation Method 2
each of the plurality of light pipe structures comprising a reflective surface
Data Source
AI summary
Embodiments disclosed herein relate to a light pipe structure for thermal processing of semiconductor substrates. In one embodiment, a light pipe window structure for use in a thermal process chamber includes a transparent plate, and a plurality of light pipe structures formed in a transparent material that is coupled to the transparent plate, each of the plurality of light pipe structures comprising a reflective surface and having a longitudinal axis disposed in a substantially perpendicular relation to a plane of the transparent plate.