Light-Emitting Pixel Structure With Embedded Heat Dissipation Particles
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Solution Overview
Problem
Existing light emitting devices face challenges in effectively dissipating heat, which affects their service life and performance, particularly in high-resolution display panels.
Innovation Solution
Incorporating heat dissipation particles with thermal conductivity greater than 50 W·m−1·K−1 into the light-converting unit, pixel define layer, separation layer, and adhesive layer to enhance heat dissipation, thereby reducing heat generation and increasing the service life of the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation particles are incorporated into multiple layers, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent combines heat dissipation functionality across multiple layers (pixel define layer, separation layer, adhesive layer) by incorporating heat dissipation particles into each layer. This merging approach creates a distributed heat dissipation network that efficiently manages thermal load throughout the device structure, resolving the contradiction by integrating heat dissipation into the existing multi-layer architecture rather than adding separate heat dissipation components.
Solution Approach 2:
The heat dissipation particles serve multiple functions simultaneously: they dissipate heat, maintain structural integrity of the layers, and do not interfere with the optical or electrical functions of the light emitting device. By making the particles multi-functional, the patent improves heat dissipation without requiring additional specialized components that would increase device complexity.
2Duration of action of stationary object
If heat dissipation particles are incorporated into multiple layers, then service life is improved, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation particles are incorporated into the layers during the manufacturing process itself, rather than being added as a separate post-processing step. The particles are mixed into the material compositions of the pixel define layer, separation layer, and adhesive layer before lamination, ensuring heat dissipation functionality is built-in from the start. This preliminary incorporation extends service life while avoiding complex post-manufacturing assembly steps.
Solution Approach 2:
The patent uses composite materials by combining heat dissipation particles with the base materials of each layer (pixel define material, separation material, adhesive material). These composite materials are then used to create the respective layers, allowing heat dissipation functionality to be integrated into the material composition itself. This approach simplifies manufacturing compared to adding separate heat dissipation components, as the heat dissipation property becomes an inherent characteristic of the layer materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of heat dissipation particles improves heat dissipation, extending the service life and maintaining the performance of the display panel by reducing heat-related degradation.
Implementation Method 1
heat dissipation particles with thermal conductivity greater than 50 W·m−1·K−1
Data Source
AI summary
A light emitting device includes a first substrate, a light-emitting unit, a pixel define layer, an adhesive layer and a plurality of scattering particles. The light-emitting unit is disposed on the first substrate. The pixel define layer is disposed on the first substrate and includes an opening. At least one portion of the light-emitting unit is disposed in the opening. The plurality of scattering particles are disposed on the first substrate. At least one portion of the plurality of scattering particles are overlapped with the at least one portion of the light-emitting unit.