Light-Emitting Plate Via Structure for Solder Resist Adhesion
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Solution Overview
Problem
The solder resist layer in Mini-LED display devices peels off due to poor adhesion between the solder resist layer and the metal wires, exacerbated by thermal expansion during reliability tests.
Innovation Solution
Incorporating vias in the metal wires, allowing the solder resist layer to extend into these vias and connect to the substrate, thereby enhancing adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a solder resist layer is provided on the metal wires to prevent corrosion and enhance reflection, then the light-emitting efficiency is improved, but the adhesion to the metal wires is poor causing peeling during thermal expansion
Solution Approach 1:
The patent applies local quality by creating different surface characteristics at different locations of the metal wire. The etched grooves or holes are formed locally on the metal wire surface to provide enhanced adhesion regions, while the rest of the surface maintains its original reflective properties. This localized modification allows the solder resist layer to adhere strongly at the groove/hole regions while still providing good light reflection from the overall wire surface.
Solution Approach 2:
The patent implements preliminary action by pre-processing the metal wire surface through etching grooves or holes before applying the solder resist layer. This preliminary surface modification creates anchoring features that will later provide strong adhesion for the solder resist layer during subsequent coating processes, preventing peeling during thermal expansion in advance.
2Stability of the object's composition
If the solder resist layer has great adhesion to the substrate, then the overall structure is stable, but the adhesion to the metal wires is poor leading to peeling
Solution Approach 1:
The patent creates localized adhesion enhancement by forming etched grooves or holes at specific locations on the metal wire surface. These localized features provide strong bonding points for the solder resist layer, ensuring that the layer remains attached to the metal wires during thermal expansion while maintaining the overall structural stability of the display device.
Solution Approach 2:
The patent effectively creates a composite structure by combining the metal wire, the etched groove/hole features, and the solder resist layer into an integrated system. The etched features act as an intermediate structure that bridges the metal wire and the solder resist layer, providing both mechanical anchoring and thermal stability for the composite assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves adhesion between the solder resist layer and the substrate, preventing peeling and enhancing thermal stability.
Implementation Method 1
one or more vias are defined in the metal wire and the solder resist layer extends into the one or more vias
Implementation Method 2
it is easy for the solder resist layer to peel off due to thermal expansion in the thermal test of reliability tests
Data Source
AI summary
Light-emitting plates and display devices are provided by the present application. The light-emitting plate includes a substrate, a driving layer disposed on the substrate and including a metal wire, a pad disposed on a side of the driving layer facing away from the substrate and connected to the driving layer, a light-emitting element disposed on a side of the pad facing away from the substrate and connected to the pad; and a solder resist layer disposed on the side of the driving layer facing away from the substrate. The solder resist layer is defined with an opening configured to expose the light-emitting element. One or more vias are defined in the metal wire and the solder resist layer extends into the one or more vias.