Light Receiver Insulation Layout for Moisture Damage Containment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor light receiving devices face challenges in maintaining moisture resistance in actual operation environments, leading to reliability issues and hindering cost reduction in optical transceivers due to the need for hermetic sealing with humidity-resistant materials and complex processing.
Innovation Solution
A light receiving device configuration featuring a substrate with a first insulating portion made of a polymer material and a separation portion made of a different material, such as an inorganic insulating film, perpendicularly separating the element region from the pad region, providing enhanced moisture resistance without the need for hermetic sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic sealing is used to secure moisture resistance, then reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent divides the protective structure into multiple insulating portions (first insulating portion covering the element, second insulating portion forming separation portion) made of different materials. This segmentation allows each portion to perform its specific function optimally while avoiding the need for complete hermetic sealing, thus reducing structural complexity while maintaining moisture resistance.
Solution Approach 2:
The patent applies different insulating materials in different regions: the first insulating portion covers the element region with one material optimized for element protection, while the second insulating portion forms the separation portion with a different material optimized for moisture barrier function. This local differentiation of material properties achieves effective moisture resistance without requiring complex hermetic sealing throughout the entire device.
2Reliability
If hermetic sealing with humidity-resistant materials is used, then moisture resistance is improved, but manufacturing cost increases
Solution Approach 1:
The protective structure is segmented into multiple insulating portions made of different materials, allowing optimization of material selection and processing for each region. This reduces manufacturing cost compared to using expensive hermetic sealing materials throughout the entire device structure.
Solution Approach 2:
Different insulating materials are applied locally where needed: the first insulating portion uses material optimized for element coverage, while the second insulating portion uses material optimized for moisture barrier function in the separation region. This localized material application reduces overall manufacturing cost while achieving effective moisture resistance.
3Reliability
If hermetic sealing processing is used to secure moisture resistance, then reliability is improved, but ease of manufacture deteriorates due to complicated processing steps
Solution Approach 1:
The manufacturing process is segmented into distinct steps for forming the first insulating portion and the second insulating portion separately. This segmentation allows each insulating layer to be processed independently using appropriate techniques, avoiding the need for complex hermetic sealing processing while achieving effective moisture resistance.
Solution Approach 2:
The patent applies different insulating materials in different regions with processing optimized for each region's requirements. The first insulating portion is processed for element coverage, while the second insulating portion is processed for forming the separation structure. This localized processing approach simplifies manufacturing compared to uniform hermetic sealing processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the reliability of the light receiving device by maintaining moisture resistance even if the pad region is damaged, simplifying the optical transceiver structure and reducing costs.
Implementation Method 1
a first insulating portion covering the substrate and the element portion; and a separation portion being formed by a second insulating portion perpendicularly to a substrate surface between a pad region and an element region including the element portion, the second insulating portion being made of a material different from a material of the first insulating portion
Data Source
AI summary
A light receiving device according to the present disclosure includes an element portion in which at least a first contact layer, a light absorbing layer, and a second contact layer are laminated in this order on a substrate. The substrate and the element portion are covered with a first insulating portion made of, for example, a polymer material. Regarding the substrate surface, a separation portion formed by a second insulating portion perpendicularly to the substrate surface is provided between an element region including an element portion of the light receiving device and a pad region including a pad that electrically and mechanically connects to the outside of the element. Even if the pad in the pad region or the vicinity thereof is damaged by external force, the moisture resistance of the second insulating portion keeps the deterioration of the moisture resistance due to the damage within the pad region.