Light-Receiving Element Pixel Groove Sequencing to Cut Leakage

The patent applies preliminary action by forming the first groove for electrode extraction before forming the second groove for pixel separation. This sequential approach allows the side surface of the mesa to be protected during the first etching process, preventing damage that would lead to leakage current. The first groove formation is completed with proper mask deposition and etching, then the second groove is formed subsequently, ensuring that critical interfaces are not exposed to damaging conditions during mask deposition.

The patent applies segmentation by dividing the groove formation process into two distinct stages: first forming the electrode extraction groove, then forming the pixel separation groove. This segmentation allows for controlled exposure and protection of the mesa side surface at different process stages. During the first mask deposition, the side surface is protected, and subsequent processing steps are designed to minimize exposure, thereby reducing damage while still enabling both types of grooves to be formed.

The patent implements preliminary action by establishing the first groove structure with proper mask protection before proceeding to second groove formation. This preliminary structuring creates a protected configuration that prevents mesa interface damage during subsequent processing. The method maintains manufacturing simplicity by using standard deposition and etching techniques, but sequences them to achieve better reliability outcomes.