Light-Reflective Anisotropic Conductive Adhesive for LED Efficiency
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Solution Overview
Problem
Conventional light-emitting devices face reduced light emission efficiency due to absorption of light by gold wires and die-bonding adhesives, and increased production costs from requiring a light reflecting layer, along with low initial die shear strength in silicone resin-based anisotropic conductive adhesives.
Innovation Solution
A light-reflective anisotropic conductive adhesive comprising a thermosetting resin composition with glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane, conductive particles coated with metal, and light-reflective insulating particles such as titanium oxide, which enhances light reflection and maintains high die shear strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a light reflecting layer is provided on the LED element to prevent light absorption, then light emission efficiency is improved, but production cost increases due to metal vapor deposition process
Solution Approach 1:
The patent combines the light reflecting function and the adhesive bonding function into a single material - the anisotropic conductive adhesive itself. The adhesive contains light-reflective particles (such as titanium oxide, aluminum oxide, or silver particles) dispersed within the resin matrix, allowing it to both bond the LED element to the substrate and reflect light back through the element without requiring a separate light reflecting layer.
Solution Approach 2:
The anisotropic conductive adhesive is designed to perform multiple functions simultaneously: electrical conduction in the horizontal direction, light reflection, and adhesive bonding. This multi-functional material eliminates the need for separate functional layers, reducing manufacturing steps and costs while maintaining or improving light emission efficiency.
2Reliability
If epoxy resin is used as binder resin for anisotropic conductive paste, then connection reliability is improved, but light transmittance deteriorates due to absorption in near ultraviolet to near infrared region
Solution Approach 1:
The patent changes the chemical composition parameter of the binder resin from epoxy resin to silicone resin. Silicone resin has superior light transmittance properties across the ultraviolet, visible, and near infrared regions compared to epoxy resin, while still providing adequate connection reliability when combined with the anisotropic conductive particles and light-reflective particles.
3Stability of the object's composition
If silicone resin is used as binder resin, then light stability is improved, but initial die shear strength deteriorates
Solution Approach 1:
The patent creates a composite anisotropic conductive adhesive system combining silicone resin with specific ratios of conductive particles (such as metal particles or carbon particles) and light-reflective particles. This composite formulation enhances the mechanical strength and die shear resistance of the silicone resin-based adhesive while maintaining its light stability and resistance to yellowing over time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves light-emitting efficiency by reflecting light without the need for a separate light reflecting layer, maintaining high die shear strength and luminous flux over long-term use, and reducing production costs.
Implementation Method 1
light-reflective insulating particles... The light-reflective anisotropic conductive adhesive reflects light without the need for a separate light reflecting layer
Implementation Method 2
a light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board, the light-reflective anisotropic conductive adhesive including a thermosetting resin composition containing a silicone resin and a curing agent
Implementation Method 3
anisotropic conductive connection of a light-emitting element to a wiring board... anisotropic conductive adhesive
Data Source
AI summary
A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring board includes a thermosetting resin composition containing a silicone resin and a curing agent, conductive particles and light-reflective insulating particles. The light-reflective insulating particle is at least one kind of inorganic particles selected from the group consisting of titanium oxide, boron nitride, zinc oxide, silicon oxide, and aluminum oxide. The silicone resin is a glycidyloxyalkyl-alicyclic alkyl-modified organopolysiloxane.
