Light-Releasable Adhesive Laminate for Wafer Polishing Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor integration techniques face challenges in achieving a laminate structure with both bonding and releasing functions in a single layer, particularly during the polishing and separation of semiconductor wafers, where strong adhesion is required for polishing and weak adhesion is needed for easy separation.
Innovation Solution
A laminate is developed with an adhesive composition containing a polysiloxane resin as the adhesive component and a (meth)acrylic polymer with a light-absorbing structured unit, allowing for both strong bonding and easy separation through light irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a two-layer structure with separate bonding layer and separation layer is used, then the bonding function and releasing function are clearly divided, but the laminate structure becomes more complex and the number of layers increases
Solution Approach 1:
The patent merges the bonding layer and separation layer into a single integrated adhesive layer. This layer contains both adhesive components (for bonding) and light-absorbing components (for separation), allowing one layer to perform both bonding and releasing functions simultaneously, thereby simplifying the laminate structure while maintaining functional reliability
Solution Approach 2:
The adhesive layer is designed with multi-functionality, serving both as a bonding agent to attach the semiconductor wafer to the support substrate and as a separation layer that enables light-induced release. The layer contains adhesive components for bonding and light-absorbing components for separation, making it a universal layer that performs multiple critical functions
2Device complexity
If a single-layer adhesive composition is used for both bonding and releasing functions, then the laminate structure is simplified, but it becomes difficult to achieve both strong adhesion during polishing and easy separation after polishing
Solution Approach 1:
The adhesive layer exhibits local quality through its composite composition: adhesive components (such as polysiloxane or acrylic resin) provide strong bonding characteristics in the planar direction during polishing, while light-absorbing components (such as azobenzene or cinnamic acid derivatives) localized within the same layer enable easy separation in the longitudinal direction after polishing through light irradiation
Solution Approach 2:
The adhesive layer is formulated as a composite material containing multiple functional components: adhesive components (polysiloxane, acrylic resin) for strong bonding and light-absorbing components (azobenzene, cinnamic acid derivatives) for light-induced separation. This composite structure enables the single layer to achieve both strong adhesion during polishing and easy separation after polishing
3Strength
If strong adhesive force is applied to withstand polishing stress, then the semiconductor wafer remains stable during polishing, but the wafer becomes difficult to separate after polishing
Solution Approach 1:
The adhesive layer exhibits dynamic characteristics where its bonding strength can be modulated. During polishing, the adhesive components provide strong bonding to withstand mechanical stress. After polishing, light irradiation activates the light-absorbing components, dynamically changing the layer's properties to enable easy separation, thus adapting the adhesive force from strong to weak based on process requirements
Solution Approach 2:
The adhesive layer utilizes parameter changes through light irradiation to switch between bonding and separation modes. The light-absorbing components absorb light energy and undergo chemical or physical changes (such as isomerization or decomposition) that alter the layer's adhesive properties, transitioning from strong adhesion during polishing to easy separation after polishing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate effectively bonds and separates semiconductor substrates during polishing and post-polishing processing, providing a simpler and more efficient production method for processed semiconductor substrates.
Implementation Method 1
a (meth)acrylic polymer including a silicone-based first unit and a light-absorbing structured second unit
Implementation Method 2
release through irradiation with light such as a laser
Implementation Method 3
the adhesive layer absorbs light emitted from a side of the support substrate
Data Source
AI summary
A laminate including an adhesive layer that has both a bonding function and a releasing function in a single layer and can be released through light irradiation, an adhesive composition for forming the releasable adhesive layer, and a method for producing a processed semiconductor substrate using the laminate. The adhesive composition includes an adhesive component and a release agent component, wherein the adhesive component contains a polysiloxane resin, and the release agent component contains a (meth)acrylic polymer including a silicone-based first unit and a light-absorbing structured second unit.