Light-Release Adhesive Composition for Clean Semiconductor Debonding
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Solution Overview
Problem
Existing release agent and adhesive layers used in semiconductor processing are difficult to clean due to residual foreign matter, which complicates the removal of semiconductor substrates from support substrates after light irradiation, affecting both releasability and cleanability.
Innovation Solution
A release agent and adhesive composition comprising a Novolac resin with specific structural units and a siloxane backbone-containing epoxy resin, which are altered by light irradiation to facilitate easy separation and enhance cleanability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional release agent layer or adhesive layer is used, then the semiconductor substrate can be adhered to the support substrate, but foreign matter such as adhesive residues remains on the surface after release, making cleaning difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the release agent and adhesive layers by incorporating specific compounds (carboxylic acid groups, hydroxyl groups, amine groups) that enable both strong adhesion during processing and easy release afterward. The release agent contains carboxylic acid groups that bond to aluminum oxide surfaces, while the adhesive contains hydroxyl or amine groups that provide controlled adhesion, allowing the substrate to be firmly held during fabrication but easily released when needed.
Solution Approach 2:
The patent uses composite material structures where the release agent layer and adhesive layer are composed of multiple functional components working together. The release agent combines carboxylic acid groups for bonding with aluminum oxide and hydrophilic groups for clean release. The adhesive combines hydroxyl or amine groups for controlled adhesion with polymer matrices. This composite approach enables both reliable adhesion during processing and easy, clean release afterward.
2Strength
If the adhesion force is strong to withstand polishing stress, then the semiconductor wafer remains stable during polishing, but it becomes difficult to remove the wafer from the support after polishing
Solution Approach 1:
The patent applies local quality by creating different functional zones within the adhesive and release agent systems. The adhesive layer has localized hydroxyl or amine groups that provide strong bonding during polishing, while the release agent layer has carboxylic acid groups that create a controlled weak bond for easy removal. This spatial and functional differentiation allows the system to exhibit strong adhesion where needed and easy release where required.
Solution Approach 2:
The patent introduces dynamic control of adhesion strength through the release agent composition that can transition from a bonded state to a released state. The carboxylic acid groups in the release agent form reversible bonds with the aluminum oxide support, allowing strong adhesion during polishing that can be easily broken for removal. This dynamic behavior enables the system to adapt its adhesion strength based on the processing stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent releasability and cleanability, allowing for efficient separation of semiconductor substrates from support substrates while minimizing residual foreign matter, thus improving the manufacturing process.
Implementation Method 1
the release layer includes a Novolac resin that is altered by absorbing light having a wavelength of 190 nm to 600 nm emitted through the support
Data Source
AI summary
A release agent composition for light irradiation release or an adhesive composition for light irradiation release, contains a Novolac resin having at least one of a hydroxy group directly bonded to an aromatic ring and a carboxy group directly bonded to an aromatic ring, and a siloxane backbone-containing epoxy resin, and a solvent.