Light-Absorbing Release Layer for Clean Semiconductor Wafer Separation
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Solution Overview
Problem
Current semiconductor processing techniques face challenges in achieving easy separation of semiconductor substrates from support substrates during polishing, with existing release methods being inefficient and leaving residues that are difficult to clean, especially after light irradiation.
Innovation Solution
A laminate comprising a semiconductor substrate, a light-transmissive support substrate, and an adhesive and release layer formed with a specific compound and organosiloxane polymer, where the release layer absorbs light to facilitate easy separation and becomes soluble in cleaning agents, allowing for effective residue removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a release layer is designed to provide strong adhesive force during polishing, then the semiconductor wafer remains stable during processing, but it becomes difficult to separate the wafer from the support substrate after polishing
Solution Approach 1:
The release layer undergoes a parameter change in its adhesive properties through light irradiation. Before irradiation, it maintains strong adhesion to hold the wafer during polishing. After irradiation, the adhesive force is reduced to enable easy separation. This dynamic parameter change resolves the contradiction between needing strong adhesion during processing and easy separation afterward.
Solution Approach 2:
The release layer transitions from a static adhesive layer to a dynamic one that can change its adhesive properties on demand. The layer's adhesive force is not fixed but can be modulated by light irradiation, allowing it to adapt between the two opposing requirements of strong holding during polishing and easy release afterward.
2Ease of operation
If conventional release methods are used, then separation can be achieved, but residues remain on the semiconductor substrate that are difficult to clean
Solution Approach 1:
The release layer's chemical structure is changed through light irradiation, transforming it from a state that provides adhesion to a state that is soluble in cleaning agents. This parameter change in solubility allows the layer to be easily removed without leaving residues on the substrate.
Solution Approach 2:
The release layer is designed to be completely extractable or removable after serving its purpose. Through light irradiation, it transforms into a form that can be fully dissolved and removed by cleaning agents, leaving no harmful residues on the semiconductor substrate.
3Object-generated harmful factors
If the release layer is made soluble for easy cleaning, then residues can be removed effectively, but it becomes difficult to maintain stable adhesion during polishing
Solution Approach 1:
The release layer dynamically switches between two states: an adhesive state during polishing and a soluble state for cleaning. The light irradiation acts as a trigger to switch between these states, allowing the layer to provide strong adhesion when needed and become soluble for removal when needed.
Solution Approach 2:
The release layer is designed with preliminary dual functionality: it is formulated to provide strong adhesion first, then after light irradiation, it transforms to become soluble for easy removal. This preliminary design of sequential functionality resolves the contradiction between adhesion strength and solubility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate enables efficient separation of semiconductor substrates from support substrates during processing and ensures easy cleaning of residues, improving the semiconductor substrate processing efficiency and yield.
Implementation Method 1
the release layer absorbs light emitted from a side of the support substrate and then is used for release the semiconductor substrate and the support substrate
Implementation Method 2
a compound that has a structure for absorbing the light, contributes to easy release of the semiconductor substrate and the support substrate by absorbing the light, and contains at least one hydroxy group
Data Source
AI summary
A laminate containing: a semiconductor substrate; a light-transmissive support substrate; and an adhesive layer and a release layer that are provided between the semiconductor substrate and the support substrate, wherein the release layer absorbs light emitted from a side of the support substrate and then is used for release the semiconductor substrate and the support substrate, the release layer is a layer formed of a release agent composition, and the release agent composition contains: a compound that has a structure for absorbing the light, contributes to easy release of the semiconductor substrate and the support substrate by absorbing the light, and contains at least one hydroxy group; and an organosiloxane polymer.