Light Semiconductor Device Coplanar Waveguide Signal Path
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Solution Overview
Problem
Existing light semiconductor devices face challenges in securing a reliable high-frequency signal return path and efficient heat dissipation, particularly due to integration issues between the modulator and laser units, which affect inductance and thermal conductivity.
Innovation Solution
The light semiconductor device incorporates a carrier with specific patterns for signal transmission and reference potential, along with first and second connection portions that facilitate a high-frequency return path and heat dissipation path by surface-contacting electrodes, reducing inductance and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor laser element is connected to the transmission line via solder and through holes, then the device can be assembled, but the inductance increases and the high-frequency signal return path becomes unreliable
Solution Approach 1:
The invention transitions from vertical through-hole connections to a planar coplanar waveguide structure on the carrier board. The signal electrode, ground electrode, and reference potential electrode are arranged in the same plane, creating a surface-mounted connection system that reduces inductance and eliminates the need for through-hole penetration, thereby improving high-frequency signal integrity while maintaining assembly simplicity
Solution Approach 2:
The carrier board with coplanar waveguide structure serves as an intermediary between the semiconductor laser element and the transmission line. It provides a dedicated high-frequency signal path with controlled impedance, acting as a mediator that ensures reliable signal transmission while isolating the laser element from direct connection to the transmission line, thus reducing inductance and improving return path reliability
2Area of stationary object
If the modulator and laser unit are integrated on the carrier, then the device size is reduced, but the heat dissipation becomes more difficult due to thermal resistance
Solution Approach 1:
The invention separates the thermal management function from the electrical connection function. The carrier board's ground electrode and reference potential electrode are specifically designed to serve as heat dissipation paths, while the signal electrode handles electrical signals. This segmentation allows the integrated structure to maintain compact size while providing dedicated thermal pathways that efficiently conduct heat away from the modulator and laser unit
Solution Approach 2:
The carrier board's electrode structure is designed to perform multiple functions simultaneously: the ground electrode and reference potential electrode serve both as electrical reference paths and as heat dissipation conduits. This multi-functionality allows the compact integrated design to effectively manage heat without requiring separate thermal management components, thus maintaining small device size while improving heat dissipation
3Ease of manufacture
If the electrode connections are made through solder and transmission lines, then the assembly is simple, but the inductance increases affecting signal integrity
Solution Approach 1:
The invention replaces the traditional mechanical solder-based vertical connections with a planar electromagnetic field-based coplanar waveguide structure. The electrical connections are established through surface-mounted electrodes that create controlled impedance transmission paths, substituting the mechanical solder joint system with an electromagnetic field-guided signal path that has lower inductance and better signal integrity while remaining equally simple to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration secures a reliable high-frequency signal return path and enhances heat dissipation, improving the overall performance of the semiconductor device by reducing inductance and thermal resistance.
Implementation Method 1
a carrier (10) having a first pattern (11) for transmitting a signal and a second pattern (12) having a reference potential constituting a coplanar line together with the first pattern on a front surface
Implementation Method 2
a first connection portion (30) having one end connected to the second pattern (12) of the carrier and the other end connected to the first electrode... and a second connection portion (40) having one end connected to the front surface of the board and the other end connected to the third electrode (25) of the laser unit
Data Source
AI summary
A light semiconductor device according to an embodiment includes: a carrier having a first pattern for transmitting a signal and a second pattern having a reference potential constituting a coplanar line together with the first pattern on a front surface; a modulator having a first electrode provided on a back surface and connected to the second pattern of the carrier and a second electrode provided on a front surface and connected to the first pattern of the carrier; and a first connection portion having one end connected to the second pattern of the carrier and the other end connected to the first electrode of the modulator. The front surface of the modulator and a front surface of the carrier face each other.