Light Sensing Module Barrier Structure for Encapsulation
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Solution Overview
Problem
Current light sensing devices face a decrease in light sensitivity due to the encapsulation layer material flowing into the light sensing hole during the formation of the encapsulation layer, which blocks the light sensing region, leading to reduced sensitivity and potential complete obstruction.
Innovation Solution
A light sensing module design that includes a barrier structure, such as a groove or barrier wall, around the light sensing hole to prevent the encapsulation layer material from entering the hole, ensuring the light sensing region remains unobstructed and maintaining sensitivity. This is achieved by positioning the light sensing device and hole projections to overlap, with the barrier structure separating the encapsulation layer from the light sensing hole, and using a higher viscosity encapsulation material or strategically placing the light sensing hole away from the device region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an encapsulation layer is formed to protect the device region, then the protection and sealing of the device region is improved, but the encapsulation layer material flows into the light sensing hole and blocks the light sensing region, causing a decrease in light sensitivity
Solution Approach 1:
The circuit board is divided into a device region and a mounting region, with the light sensing hole positioned in the mounting region. The encapsulation layer is formed only on the device region, segmenting the encapsulation process to avoid material flowing into the light sensing hole while still protecting the device region.
Solution Approach 2:
A barrier structure is introduced as an intermediary element between the encapsulation layer material and the light sensing hole. This barrier structure prevents the encapsulation material from flowing into the light sensing hole while allowing the encapsulation layer to form and protect the device region.
2Reliability
If the encapsulation layer material viscosity is increased to prevent flowing, then the prevention of material flow into the light sensing hole is improved, but the ease of manufacture is worsened due to difficulty in forming the encapsulation layer
Solution Approach 1:
The encapsulation process is segmented by limiting the encapsulation layer formation to only the device region, away from the light sensing hole. This segmentation allows the use of lower viscosity materials that are easier to manufacture with, while still preventing material flow into the light sensing hole through the barrier structure.
Solution Approach 2:
The barrier structure serves as an intermediary that prevents material flow without requiring high viscosity. This intermediary element allows the use of easier-to-manufacture materials while still achieving the goal of preventing encapsulation material from blocking the light sensing hole.
3Reliability
If the light sensing hole is positioned away from the device region, then the risk of encapsulation material flow into the hole is reduced, but the area available for light sensing is reduced
Solution Approach 1:
The circuit board is segmented into device region and mounting region, with the light sensing hole positioned in the mounting region adjacent to the device region. This segmentation allows the light sensing hole to be close to the device region for maximum light sensing area, while the barrier structure prevents encapsulation material from flowing into the hole.
Solution Approach 2:
The barrier structure acts as an intermediary protective element that allows the light sensing hole to be positioned in the optimal location for light sensing, while still preventing encapsulation material from blocking the hole. This intermediary enables both large light sensing area and prevention of blocking.
Data Source
AI summary
A light sensing module and a display apparatus are provided. The light sensing module includes a circuit board and a light sensing device, wherein the circuit board includes a mounting region and a device region surrounding the mounting region, an encapsulation layer is disposed on the device region, and a light sensing device, a light sensing hole and a barrier structure are provided on the mounting region, a vertical projection of the light sensing device on the mounting region at least partially overlaps with a vertical projection of the light sensing hole on the mounting region, and the barrier structure is disposed around the periphery of the light sensing hole, and separates the encapsulation layer from the light sensing hole.