Light Sensing Panel Substrate Segmentation for Imaging Sharpness
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Solution Overview
Problem
Modern electronic devices require enhanced sensitivity and sharpness in sensing functions, such as fingerprint recognition, which existing technologies fail to adequately provide due to limitations in sensor sensitivity and imaging quality.
Innovation Solution
An electronic device design incorporating a light sensing panel with a first and second substrate, optical structure layer, and display structure layer, where the sensing units are positioned between the substrates, and the optical structure layer is formed between the second substrate and the display structure layer, enhancing alignment accuracy and sensitivity through a specific manufacturing process that includes etching and polishing to reduce substrate thickness and improve imaging distance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the substrate thickness is reduced to improve imaging sharpness and sensitivity, then the imaging quality improves, but the supporting strength deteriorates
Solution Approach 1:
The patent divides the light sensing panel into multiple separate substrates (first substrate and second substrate) that are bonded together. This segmentation allows each substrate to be optimized independently - the first substrate can be thin for imaging quality while the second substrate provides structural support, resolving the contradiction between thinness and strength.
Solution Approach 2:
The patent uses composite construction by bonding multiple substrates together to form a layered structure. This composite approach combines the advantages of thin substrates (good imaging) with the advantages of thicker substrates (good strength), achieving both imaging sharpness and structural integrity simultaneously.
2Measurement precision
If the sensing units are positioned closer to the optical structure layer to improve sensitivity, then the sensitivity improves, but the alignment accuracy becomes more difficult to maintain
Solution Approach 1:
The patent segments the light sensing panel into multiple substrates with the sensing units formed on the first substrate and the optical structure layer on the second substrate. This segmentation allows independent optimization and assembly, making it easier to achieve precise alignment between sensing units and optical structures through separate positioning and bonding processes.
Solution Approach 2:
The patent introduces the second substrate as an intermediary layer between the sensing units and the optical structure layer. This intermediary structure provides additional degrees of freedom for alignment adjustment and serves as a mediator that facilitates precise positioning of both the sensing units and optical structures during the manufacturing process.
3Measurement precision
If multiple layers are added to improve sensing function then the sensitivity improves, but the device complexity increases
Solution Approach 1:
The patent designs the multi-layer structure where each layer serves multiple functions: the first substrate provides mechanical support and mounts sensing units, the second substrate provides additional support and mounts the optical structure layer, and together they achieve both structural integrity and enhanced sensing sensitivity. This multi-functionality reduces overall device complexity compared to separate dedicated components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the sharpness of imaging and sensitivity of sensors, meets thin design requirements, and increases the yield rate of semiconductor processes, reducing manufacturing costs while maintaining sufficient supporting strength for the light sensing panel.
Implementation Method 1
an optical structure layer, disposed on the second substrate and between the second substrate and the display structure layer
Data Source
AI summary
An electronic device and a manufacturing method for the electronic device are provided. The electronic device includes a display structure layer and a light sensing panel. The light sensing panel includes a first substrate; a second substrate, wherein the second substrate is disposed between the first substrate and the display structure layer; a plurality of sensing units, disposed on the first substrate and between the first substrate and the second substrate; and an optical structure layer, disposed on the second substrate and between the second substrate and the display structure layer.