Light-Sensitive Tape Singulation for Semiconductor Arrays
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Solution Overview
Problem
Current saw singulation processes for block-molded semiconductor devices face issues with sawdust and scrap particles adhering to adhesive tape, causing inefficiencies and potential damage to the saw blade, and contaminants can be transferred to completed devices during handling.
Innovation Solution
The use of light-sensitive tape, specifically UV-sensitive tape, which is de-activated by exposure to UV light to reduce tackiness, allowing for easier removal of singulated devices and reducing contamination by eliminating exposed adhesive surfaces during the cutting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive tape is used to secure block-molded arrays during saw singulation, then the array is held firmly in place for cutting, but sawdust and scrap particles adhere to the exposed adhesive surfaces causing contamination and potential saw blade damage
Solution Approach 1:
The patent removes the harmful exposed adhesive surfaces from the system by using tape that is applied only to the back of the array, eliminating the source of particle adhesion while maintaining securing function
Solution Approach 2:
The patent introduces a non-stick coating as an intermediary layer between the adhesive tape and the array, preventing particle adhesion to the tape while allowing the tape to fulfill its securing function
2Ease of operation
If adhesive tape with exposed surfaces is used during cutting, then the array can be secured to the mounting ring, but the tacky surfaces attract and hold sawdust particles that can damage the saw blade
Solution Approach 1:
The patent eliminates exposed adhesive surfaces by applying tape only to the back of the array, removing the harmful tacky surfaces that attract particles while maintaining the mounting function
Solution Approach 2:
The patent introduces a non-stick coating as a mediator between the adhesive and the array, preventing particle adhesion while allowing secure mounting
3Productivity
If traditional adhesive tape is used to hold the array, then the devices can be secured for cutting, but contaminants can be transferred to completed devices during subsequent cleaning and handling
Solution Approach 1:
The patent removes exposed adhesive surfaces that serve as contamination sources, eliminating the pathway for contaminant transfer to completed devices while maintaining cutting efficiency
Solution Approach 2:
The patent introduces a non-stick coating as a protective intermediary that prevents contaminant adhesion to the tape, ensuring device cleanliness during handling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the efficiency of the singulation process by minimizing the adherence of sawdust and scrap particles, reducing the risk of saw blade damage, and preventing contamination of completed devices, thereby improving handling and cutting efficiency while lowering costs.
Implementation Method 1
light-sensitive tape which is de-activated by exposure to UV light to reduce tackiness
Data Source
AI summary
The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.