Light-Shielding Layer Flowing Over Bonding Pad to Reduce Reflection
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Solution Overview
Problem
Display devices using light-emitting diodes (LEDs) face issues with light leakage due to ambient light reflection, leading to non-uniform color in bright states and white spots in dark states, which affect display quality.
Innovation Solution
A method of manufacturing a display device involves forming a light-shielding layer that covers and contacts a portion of the bonding pad's surface, reducing ambient light reflection by flowing and curing a light-shielding material between 180°C to 250°C to create a layer that extends from the side to the top surface of the bonding pad, thereby reducing light leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a light-shielding layer is formed to cover the bonding pad, then ambient light reflection is reduced, but the manufacturing process complexity increases
Solution Approach 1:
The patent combines the light-shielding layer formation with the existing bonding pad structure by having the light-shielding material flow to and contact a portion of the bonding pad surface during curing. This integration approach reduces the need for separate manufacturing steps while achieving the light-shielding effect.
Solution Approach 2:
The light-shielding material is applied in advance before final assembly, and its flowing and curing process is controlled to automatically conform to the bonding pad surface. This preliminary action ensures the light-shielding effect is built-in during manufacturing rather than requiring post-processing adjustments.
2Reliability
If the light-shielding material is cured at high temperature (180°C to 250°C), then the light-shielding layer is effectively formed, but thermal stress may affect surrounding components
Solution Approach 1:
The patent specifies a controlled temperature range of 180°C to 250°C for curing the light-shielding material. This parameter optimization ensures sufficient curing effectiveness while minimizing excessive thermal stress on surrounding components. The temperature range is carefully selected to balance material curing requirements with thermal tolerance of adjacent structures.
3Stability of the object's composition
If the light-shielding layer covers the bonding pad surface, then display uniformity is improved, but the bonding pad electrical connection may be affected
Solution Approach 1:
The patent specifies that the light-shielding material flows to and contacts only a portion of the bonding pad surface, not the entire surface. This local application approach ensures that critical electrical connection areas remain exposed and functional while still achieving light-shielding effects on the visible surfaces that contribute to display uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces ambient light reflection, preventing non-uniform colors in bright states and white spots in dark states, enhancing display quality by shielding the bonding pad surfaces with a light-shielding layer.
Implementation Method 1
The temperature of the light-shielding material is increased to cure the light-shielding material into a light-shielding layer
Implementation Method 2
During curing the light-shielding material into the light-shielding layer, the light-shielding material flows to and contacts a portion of a surface of the bonding pad
Implementation Method 3
The light-shielding layer is disposed on the dielectric layer, and at least covers and contacts a portion of a surface of the bonding pad... the probability of that the display device reflects the ambient light can be reduced
Data Source
AI summary
A method of manufacturing a display device includes the following steps. A bonding pad is formed on a dielectric layer. A light-shielding material is formed on the dielectric layer. A temperature of the light-shielding material is increased such that the light-shielding material is cured into a light-shielding layer. During curing the light-shielding material into the light-shielding layer, the light-shielding material flows to and contacts a portion of a surface of the bonding pad. A light-emitting element is electrically connected to the bonding pad.