Light Shielding Film Composition with Low Reflection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light shielding compositions, such as those disclosed in JP2019-082533A, exhibit higher reflectivity than required, necessitating a composition that balances excellent light shielding properties with low reflection properties.
Innovation Solution
A composition comprising carbon black, barium sulfate, copper phthalocyanine or its derivative, a resin, and specific solvents with varying boiling points, along with a polymerization initiator, solvent A with a solubility parameter of 11.0 to 14.0 (cal/cm3)1/2, and optional additives like metal-containing particles and silicone-based surfactants, to form a cured film with improved light shielding and low reflection properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a composition including carbon black and barium sulfate is used for light shielding, then light shielding properties are improved, but reflectivity increases
Solution Approach 1:
The patent uses a composite material system combining carbon black, barium sulfate, and copper phthalocyanine in specific proportions. This multi-component composite achieves both excellent light shielding properties and low reflectivity by leveraging the complementary characteristics of each material: carbon black for light absorption, barium sulfate for refractive index control, and copper phthalocyanine for enhanced optical performance.
Solution Approach 2:
The patent optimizes the ratio parameters of the composition components, specifically setting carbon black at 60-80 parts, barium sulfate at 10-30 parts, and copper phthalocyanine at 5-20 parts by mass. This parameter optimization resolves the contradiction by finding the optimal balance point where light shielding is maximized while reflectivity is minimized.
2Reliability
If multiple solvents with different boiling points are used, then film formation and drying properties are improved, but composition complexity increases
Solution Approach 1:
The patent selects solvents based on their boiling point parameters, using a first solvent with boiling point 100-150°C and a second solvent with boiling point 150-200°C. This parameter-based selection optimizes film formation during coating and controlled drying without requiring complex solvent blends, resolving the contradiction between film quality and system simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition produces a cured film with enhanced light shielding properties, low reflection, improved pencil hardness, peeling resistance, viscosity stability, and solvent resistance, while maintaining excellent light shielding performance.
Implementation Method 1
a composition including black powder has been used for various purposes... the composition is used in the production of a light shielding film... for the purpose of shielding colored pixels from light
Implementation Method 2
a pigment dispersion resist composition for a black matrix with good light shielding properties and low reflectivity, including carbon black, precipitated barium sulfate
Implementation Method 3
a compound including an unsaturated double bond; and a polymerization initiator
Data Source
AI summary
A composition with which a cured film having excellent light shielding properties and low reflection properties can be produced is provided; a light shielding film; a solid-state imaging element; an image display device; and a method for manufacturing a cured film. The composition including carbon black, barium sulfate, one or more kinds selected from the group consisting of copper phthalocyanine and a copper phthalocyanine derivative, a resin, and a solvent, in which the solvent includes a solvent A having a boiling point of 180° C. or higher, a solvent B having a boiling point of 140° C. or higher and lower than 180°° C., and a solvent C having a boiling point of 100° C. or higher and lower than 140° C.