Light-Shielding Optical Element for Dense LED Module Packaging
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Solution Overview
Problem
Conventional semiconductor light emitting devices face issues with light leakage and crosstalk due to the peeling or cracking of coating films on side surfaces, especially under thermal stress, which affects reliability and light shielding performance.
Innovation Solution
A semiconductor light emitting device with a light-transmitting optical element featuring a light shielding film on its side surface, which forms an annular frame covering the peripheral edge of a wavelength conversion body and is adhered to a wiring substrate using an adhesive layer, preventing light leakage and enhancing reliability without a separate cover member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a coating film is provided on the side surface of the light emitting element or wavelength conversion member to prevent light leakage, then light shielding characteristics are improved, but the coating film may peel off or crack due to thermal stress during mounting or usage, worsening reliability
Solution Approach 1:
The patent extracts the light shielding function from the coating film and transfers it to a dedicated light shielding member (frame structure). This separate light shielding member is positioned between adjacent light emitting elements to block light leakage, while the original coating films on the light emitting elements and wavelength conversion members can focus on their primary functions without the added stress of providing structural light shielding support.
Solution Approach 2:
The light shielding member acts as an intermediary element between adjacent light emitting elements. This mediator structure specifically addresses the light leakage problem by being positioned in the space between elements, preventing direct light interaction while allowing the original coating films to maintain their adhesion to the light emitting elements without additional thermal stress from dual functionality requirements.
2Object-affected harmful factors
If a separate cover member is provided on the side surface of the light emitting element to improve light shielding, then light leakage prevention is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The light shielding function is merged with the existing structural framework of the device. The light shielding member is integrated into the overall device structure, working in conjunction with the mounting substrate and holder, rather than being a completely separate cover member. This integration reduces the number of discrete components and simplifies the overall device architecture.
Solution Approach 2:
The light shielding member serves multiple functions: it provides light shielding between adjacent elements, contributes to the structural framework of the device, and can assist in thermal management by providing additional surface area. This multi-functionality reduces the need for separate dedicated components for each function, thereby reducing overall device complexity.
3Productivity
If multiple light emitting devices are arranged close together to increase output, then productivity and light output are improved, but light crosstalk between adjacent devices increases
Solution Approach 1:
The light shielding member divides the space between adjacent light emitting elements into separate optical zones. By positioning the light shielding member vertically between elements, it creates distinct light propagation paths for each element, preventing light from one element from reaching adjacent elements. This spatial segmentation enables higher device density without compromising light isolation.
Solution Approach 2:
The light shielding member extends in the vertical dimension between adjacent light emitting elements, creating a three-dimensional light isolation structure. This vertical extension adds a new dimensional approach to light shielding that complements traditional horizontal spacing, allowing devices to be arranged more closely together while maintaining effective light isolation through the added vertical barrier.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields emitted light, suppresses crosstalk between adjacent devices, and ensures high reliability by preventing light leakage and maintaining excellent light shielding characteristics, even under thermal stress, without the need for individual cover members.
Implementation Method 1
a light-transmitting optical element having a light shielding film provided on a side surface of a plate-shaped light-transmitting optical body
Data Source
Figure 1A~1C
Figure 2
Figure 3A
AI summary
A semiconductor light emitting device includes: a wiring substrate on which a p-electrode and an n-electrode are provided on a substrate; a light-emitting functional layer including a p-type semiconductor layer and an n-type semiconductor layer connected to the p-electrode and the n-electrode, respectively, and bonded onto the wiring substrate; a light-transmitting optical element having a light shielding film provided on a side surface of a plate-shaped light-transmitting optical body and which has an annular frame portion that covers a peripheral edge portion of a back surface of the light-transmitting optical body and formed on the peripheral edge portion; and an adhesive layer configured to adhere the light-transmitting optical element to an upper surface of the wiring substrate such that the light-emitting functional layer is inserted into a recessed portion inside the frame portion. The recessed portion is filled with the adhesive layer.