Light-Shielding Elements for Polysilicon Crystal Control
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Solution Overview
Problem
The existing methods for forming polysilicon layers in AMOLED display substrate assemblies, such as the Excimer Laser Annealing (ELA) process, fail to meet the distinct crystal form requirements of gate drive and source drive circuits, leading to inefficiencies and issues like infrared light spots on the display screen due to external light interference.
Innovation Solution
A display substrate assembly is created with a light-shielding layer having light-shielding elements of different sizes, which generate varying thermal energy distributions, resulting in polysilicon layers with distinct crystal forms to meet the specific needs of different circuit regions, including a hexagonal crystal form for the gate drive circuit and a tetragonal crystal form for the source drive circuit, and a tetragonal form for the infrared sensing region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the same polysilicon layer formation method is used for gate drive circuit and source drive circuit, then the manufacturing process is simple, but the crystal form requirements of different circuits cannot be met
Solution Approach 1:
The patent applies local quality by using light-shielding elements with different sizes at different locations to create different thermal energy distributions. Specifically, larger light-shielding elements are used for source drive circuits to produce tetragonal crystal form, while smaller light-shielding elements are used for gate drive circuits to produce hexagonal crystal form, thereby meeting the distinct crystal form requirements of different circuit regions through localized structural variations.
Solution Approach 2:
The patent changes the size parameter of light-shielding elements to control the crystal form of polysilicon layers. By varying the size of light-shielding elements, different thermal energy distributions are generated during laser annealing, which directly controls whether the polysilicon forms hexagonal or tetragonal crystal structures, thus achieving precise control over crystal form through parameter modification.
2Device complexity
If external light interference is not blocked, then the structure is simple, but infrared light spots appear on the display screen
Solution Approach 1:
The patent converts the harmful effect of external light interference into a beneficial outcome by using light-shielding elements that not only block infrared light to prevent spots on the display screen but also generate controlled thermal energy distributions during laser annealing. The same light-shielding structures that block harmful infrared light during operation are utilized to create the desired thermal effects during manufacturing, thereby transforming a potential harm into a useful function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the polysilicon layers in the display substrate assembly meet the unique requirements of each circuit region, enhancing the mobility and uniformity of the TFTs, reducing leakage current, and preventing external light interference, thereby improving the display performance and eliminating infrared light spots.
Implementation Method 1
energy lights reflected and/or refracted through the plurality of light-shielding elements of different sizes respectively generate different thermal energy distributions
Implementation Method 2
energy lights reflected and/or refracted through the plurality of light-shielding elements of different sizes respectively generate different thermal energy distributions
Implementation Method 3
generate different thermal energy distributions on the plurality of polysilicon layers corresponding to the plurality of light-shielding elements
Implementation Method 4
an Excimer Laser Annealing (ELA for short) process is used to anneal the amorphous silicon to obtain polysilicon
Implementation Method 5
an Excimer Laser Annealing (ELA for short) process is used to anneal the amorphous silicon
Data Source
AI summary
In an embodiment, there is provided a display substrate assembly. The display substrate assembly includes: a base substrate; a light-shielding layer on the base substrate, the light-shielding layer having a plurality of light-shielding elements; and a plurality of polysilicon layers respectively on sides of the plurality of light-shielding elements away from the base substrate; wherein the plurality of light-shielding elements have different sizes such that energy lights reflected and/or refracted through the plurality of light-shielding elements of different sizes respectively generate different thermal energy distributions on the plurality of polysilicon layers corresponding to the plurality of light-shielding elements, causing the plurality of polysilicon layers to have different crystal forms. Meanwhile, a method of manufacturing the display substrate assembly and a display apparatus including the aforementioned display substrate assembly are also provided.