Light-Shielding Sheet Shields Electrostatic Protection Circuit from UV Curing
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Solution Overview
Problem
Liquid crystal devices with electrostatic protection circuits experience increased power consumption due to current leakage from diode elements caused by UV light exposure during the curing of UV-curable molding members, which is not a significant issue in devices without memory elements.
Innovation Solution
Shielding the electrostatic protection circuit from UV light during the curing process using light-shielding members, such as polarizing plates, to prevent current-voltage property variations in diode elements, thereby reducing power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If UV-curable molding member is used to protect the connecting portion, then protection from external stress is improved, but current leakage from diode elements occurs due to UV light exposure
Solution Approach 1:
A light-shielding sheet is introduced as an intermediary component between the UV light source and the electrostatic protection circuit. This sheet blocks UV light from reaching the diode elements while allowing the UV-curable molding member to be cured, thus preventing current leakage without sacrificing the protective function of the molding member.
Solution Approach 2:
The patent separates the light-shielding function from the molding function by using a distinct light-shielding sheet that is separate and apart from the electro-optical device. This segmentation allows the molding member to perform its protective function while the light-shielding sheet independently prevents UV light from reaching sensitive components.
2Reliability
If electrostatic protection circuit is added to protect elements from static electricity, then reliability is improved, but power consumption increases due to current leakage
Solution Approach 1:
The light-shielding sheet acts as a mediator that protects the electrostatic protection circuit from UV light exposure during the curing process. By blocking UV light from reaching the diode elements, the sheet prevents changes in current-voltage characteristics and eliminates micro-current leakage, thereby maintaining low power consumption while preserving the electrostatic protection function.
3Strength
If UV light is used to cure the molding member, then bonding strength is improved, but current-voltage characteristics of diode elements are varied
Solution Approach 1:
The light-shielding sheet is positioned specifically over the electrostatic protection circuit region, creating a localized shield that blocks UV light only where needed. This allows UV light to cure the molding member in other areas where bonding strength is required, while preventing UV exposure to the sensitive diode elements in the electrostatic protection circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces power consumption in liquid crystal devices with memory elements by preventing current leakage, maintaining low power usage even with the inclusion of electrostatic protection circuits.
Implementation Method 1
curing the molding member by irradiating the molding member with UV light
Implementation Method 2
shielding the electrostatic protection circuit from UV light during the curing process
Data Source
AI summary
A method for manufacturing an electro-optical device including an element substrate which includes a plurality of pixels including pixel electrodes and which is connected to a circuit board includes providing a UV-curable molding member on the element substrate such that the molding member extends from the element substrate to the circuit board and also includes curing the molding member by irradiating the molding member with UV light. The element substrate includes an electrostatic protection circuit. The electrostatic protection circuit is shielded from the UV light applied to the molding member in the operation of curing the molding member.