Light Source Device Base Member Heat Conduction
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Solution Overview
Problem
Existing light source devices with solid-state light sources face challenges in efficient cooling, particularly when densely mounted, due to inadequate heat dissipation, which reduces cooling efficiency and increases maintenance needs.
Innovation Solution
A light source device design featuring a base member with a planar portion in contact with the stem of each solid-state light source, ensuring effective heat conduction and dissipation, along with a position determination member and substrate arrangement for improved positional accuracy and cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor lasers are densely mounted on the printed substrate without a base, then the device complexity is reduced, but the cooling efficiency of the semiconductor lasers is reduced due to inadequate heat dissipation
Solution Approach 1:
The invention divides the heat dissipation function into two parts: the base member that contacts the semiconductor laser stem for primary heat conduction, and the printed substrate that receives heat from the base for secondary dissipation. This segmentation allows each component to be optimized for its specific function while working together to solve the heat dissipation problem in dense mounting configurations.
2Temperature
If a base is provided for each semiconductor laser to improve heat dissipation, then the cooling efficiency is improved, but the device complexity increases and dense mounting becomes difficult
Solution Approach 1:
The invention merges the base member with the printed substrate by making the base member integrally formed with or firmly attached to the substrate. This merging allows the base to provide effective heat dissipation contact with each semiconductor laser while the integrated structure prevents increased device complexity and enables dense mounting of multiple lasers on the same substrate.
3Device complexity
If the semiconductor laser is spaced apart from the printed substrate to avoid direct contact, then the device complexity is reduced, but the heat generated in the semiconductor laser is not properly dissipated
Solution Approach 1:
The invention introduces the base member as an intermediary component between the semiconductor laser and the printed substrate. The base member serves as a heat conduction mediator that efficiently transfers heat from the laser stem to the substrate, solving the heat dissipation problem while maintaining a simple overall structure without requiring direct laser-substrate contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables effective cooling of solid-state light sources even when densely arranged, extending their lifespan and reducing maintenance requirements by enhancing heat conduction and positional accuracy.
Implementation Method 1
the base member on which the plurality of solid-state light sources are provided has the planar portion that is in contact with the stem of each of the solid-state light sources. Through this, a heat conduction path from the respective solid-state light source to the base member can be ensured, and the heat generated from the respective solid-state light sources can be dissipated through one base member.
Data Source
AI summary
A light source device includes a plurality of solid-state light sources, and a base member on which the plurality of solid-state light sources are provided, wherein each of the solid-state light sources includes a stem on which a light-emitting element is provided and terminals connected to the light-emitting element, and the base member includes a hole portion into which one of the terminals is inserted and a planar portion that is in contact with the stem.