Light Source Unit Positioning via Bias and Intermediary Pin
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing image formation apparatuses face challenges in achieving precise positioning of light sources relative to optical systems, leading to deteriorated image quality due to non-uniform height of light emission portions and issues with solder peeling off from circuit boards during bending, which affects beam spot sizes and pitch.
Innovation Solution
A light source unit with a substrate mounted on a support portion, biased by an anchor member to ensure precise contact and positioning, and a rotatable adjuster for positional adjustments, along with a holding member to maintain the substrate's position relative to the support portion, allowing for stable and accurate alignment with optical elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the circuit board is bent to bring the package into contact with the support member surface, then the positioning precision of the light source is improved, but the solder may peel off from the circuit board
Solution Approach 1:
A positioning pin is introduced as an intermediary element between the circuit board and the support member. The positioning pin protrudes from the support member and contacts the circuit board at a specific positioning point, enabling precise positioning without requiring the circuit board to be bent. This eliminates the harmful effect of solder peeling while achieving the desired positioning precision.
2Ease of manufacture
If the light emission portions are fixed to the package by epoxy adhesive, then the light source can be mounted, but it is hard to precisely position them on the package
Solution Approach 1:
A positioning pin is introduced as an intermediary element between the circuit board and the support member. The positioning pin protrudes from the support member and contacts the circuit board at a specific positioning point, enabling precise positioning without requiring the circuit board to be bent. This eliminates the harmful effect of solder peeling while achieving the desired positioning precision.
3Shape
If the light emission portions are non-uniform in height, then the package surface becomes inclined relative to the circuit board, but this causes positional differences between optical elements and light emission portions
Solution Approach 1:
A positioning pin is introduced as an intermediary element between the circuit board and the support member. The positioning pin protrudes from the support member and contacts the circuit board at a specific positioning point, enabling precise positioning without requiring the circuit board to be bent. This eliminates the harmful effect of solder peeling while achieving the desired positioning precision.
Data Source
AI summary
A light source unit is provided, which includes a light source with a plurality of light emission portions two-dimensionally arranged; a substrate on which the light source is mounted; a first support portion supporting the substrate; a bias member biasing the substrate towards the first support portion; a coupling element coupling a light beam emitted from the light source; a second support portion supporting the coupling element; a holding member holding a position of the substrate relative to the first support portion, a fitting portion provided in each of the first and second support portions to rotatably fit the first and second support portions into each other around an optical axis of the light source; and a fastening member integrally fastening the first and second support portions.


