Light Source Board with Sn-Bi Alloy Reactive Layer for Keyboard Illumination
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Solution Overview
Problem
Luminous keyboards face challenges in achieving uniform light distribution, diversity of illumination, and thickness reduction while maintaining effective power consumption and user experience.
Innovation Solution
A light source board comprising a substrate with a metal reactive layer, a conductive layer, a metal alloy layer, and light sources, where the metal reactive layer is made of Sn—Bi or Sn—Ag—Cu alloys, and the conductive and protective layers are arranged with materials like silver, copper, and nickel to enhance conductivity and resistance, allowing for efficient light emission and flexible manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional light source boards are used, then basic illumination function is achieved, but light uniformity and illumination diversity are insufficient
Solution Approach 1:
The patent employs a composite material structure consisting of multiple metal layers (reactive layer, conductive layer, alloy layer, and protective layer) with specific material compositions (Sn-Bi alloy, Sn-Ag-Cu alloy, silver paste, copper, nickel, gold) to optimize light emission characteristics and achieve uniform illumination without increasing structural complexity
Solution Approach 2:
The patent optimizes illumination parameters by controlling the thickness, material composition, and arrangement of multiple metal layers, thereby adjusting electrical conductivity, thermal conductivity, and light emission properties to achieve uniform light distribution and diverse illumination effects
2Length of stationary object
If keyboard thickness is reduced, then portability is improved, but heat dissipation and power management become more difficult
Solution Approach 1:
The patent utilizes thin-film metal layers (reactive layer, conductive layer, alloy layer, and protective layer) with controlled thickness to maintain compact keyboard structure while ensuring effective heat dissipation and power management through the multi-layer thermal conduction path
Solution Approach 2:
The patent employs composite metal materials with different thermal and electrical conductivity properties in each layer to optimize heat dissipation efficiency within the reduced thickness constraint, allowing effective thermal management in a compact form factor
3Reliability
If metal layers are added to improve conductivity, then electrical performance is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary protective measures by incorporating a protective layer in advance to prevent oxidation and corrosion of the metal layers, ensuring long-term electrical reliability while streamlining the manufacturing process through integrated layer formation
Solution Approach 2:
The patent uses composite metal layer structures with specific material combinations (Sn-Bi alloy, Sn-Ag-Cu alloy, silver paste, copper, nickel, gold) to achieve high electrical conductivity while maintaining manufacturing feasibility through established deposition and bonding techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light uniformity and diversity, reduces keyboard thickness, and optimizes power consumption, enhancing user experience by providing a more efficient and versatile luminous keyboard design.
Implementation Method 1
a metal reactive layer disposed on the substrate; a metal conductive layer disposed on the metal reactive layer... arrangements of materials of the metal reactive layer and the metal conductive layer are respectively an arrangement of silver paste and copper, an arrangement of silver paste and nickel, an arrangement of silver paste and silver, an arrangement of copper paste and copper, an arrangement of copper paste and nickel, or an arrangement of copper paste and silver
Data Source
AI summary
A light source board includes a substrate; a metal reactive layer disposed on the substrate; a metal conductive layer disposed on the metal reactive layer; a metal alloy layer disposed on the metal conductive layer; and at least one light source disposed on the metal alloy layer. A material of the metal reactive layer is a Sn—Bi type alloy or a Sn—Ag—Cu type alloy, and arrangements of materials of the metal reactive layer and the metal conductive layer are respectively an arrangement of silver paste and copper, an arrangement of silver paste and nickel, an arrangement of silver paste and silver, an arrangement of copper paste and copper, an arrangement of copper paste and nickel, or an arrangement of copper paste and silver.


