Light Source Chip Etched Blind Holes Cutting

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Solution Overview

Problem

Conventional manufacturing methods for thermally assisted heads with laser diode chips result in rough cutting edges and surface cracks, leading to antireflection coating de-bonding and performance degradation during machining processes.

Innovation Solution

A manufacturing method involving the formation of blind holes on a light source bar by etching, followed by cutting along adjacent blind holes using a cutting machine with a width smaller than the blind hole, preventing contact with the side edges and ensuring a smooth edge and crack-free surface, along with a protective coating to prevent coating peeling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a blade or laser beam cuts the laser diode bar directly, then the cutting process is simple and fast, but the cutting edge becomes rough and surface cracks occur

Engineering Contradiction:

Improvecutting speedVSAvoidcutting edge quality

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by forming blind holes at predetermined positions on the light source bar before cutting. These blind holes serve as guides for the cutting blade, ensuring the blade follows a precise path and does not contact the side edges of the light source chip. This preliminary structuring enables high-speed cutting while maintaining smooth cutting edges and preventing surface cracks.

Inventive Principle:

Principle #10Preliminary action

2Ease of operation

If the cutting blade contacts the side edges of the blind hole, then cutting is easier to control, but the antireflection coating peels off and performance degrades

Engineering Contradiction:

Improvecutting controlVSAvoidcoating adhesion

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent uses the blind holes as an intermediary element between the cutting blade and the light source chip. The blind holes are positioned and dimensioned such that they guide the blade without allowing it to contact the side edges of the chip. This intermediary structure enables easy cutting control while protecting the antireflection coating from damage, thereby maintaining reliability.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Device complexity

If the light source bar is cut directly without blind holes, then the manufacturing process is simpler, but rough edges increase the possibility of coating de-bonding

Engineering Contradiction:

Improvemanufacturing process complexityVSAvoidcoating bond strength

Core Design Contradiction:

Device complexityVSStrength

Solution Approach 1:

The blind holes are formed in advance on the light source bar before the cutting operation. This preliminary action creates a structured guide path that ensures smooth cutting edges during the subsequent cutting process. Although this adds a step to the manufacturing process, it significantly strengthens the coating bond by preventing rough edges that would cause de-bonding.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method produces light source chips with smooth edges and surfaces, preventing coating peeling and maintaining performance during subsequent machining processes, thereby enhancing the thermally assisted head's performance.

Implementation Method 1

The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole

Methodology Applied

Scientific EffectGeometric constraint:

Implementation Method 2

forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar

Methodology Applied

Scientific EffectEtching:

Data Source

PatentUS8743665B2Light source chip and a thermally assisted head with the same, and manufacturing methods thereof

Publication Date: 2014.06.03 SAE MAGNETICS (HK) LTD

AI summary

A manufacturing method of a light source chip for a thermally assisted head comprises steps of (a) providing a light source bar with a surface coating formed thereon; (b) forming several blind holes on the predetermined positions of the light source bar by etching, the blind hole having a top hollowed on the surface coating and a bottom hollowed on the light source bar, and the blind hole having a first biggest width at its top; (c) cutting the light source bar along every two adjacent blind holes by a cutting machine. The cutting machine has a cutting means with a second biggest width that is smaller than the first biggest width of the blind hole, thereby cutting down an individual light source chip without contacting the side edges of the blind hole. Thus a light source chip with a smooth edge and without cracks on the surface can be obtained; and the surface coating formed thereon is hard to be peeled off.