Light Source Device Heat Conduction via Another Dimension
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Solution Overview
Problem
Existing light source devices with semiconductor laser devices are difficult to miniaturize and have limited heat dissipation due to the semiconductor laser devices being in contact with the support member only on their bottom surfaces.
Innovation Solution
A light source device design that includes a mounting body with heat conducting members, such as heat pipes or highly heat conducting blocks, which are in contact with multiple surfaces of the semiconductor laser devices, allowing for effective heat radiation through a heat radiator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If semiconductor laser devices are attached to a top surface of a support member, then the device structure is simplified, but the thickness of the device cannot be decreased
Solution Approach 1:
The patent transitions from attaching semiconductor laser devices to the top surface (vertical dimension) to mounting them on the bottom surface and having heat conducting members extend upward (horizontal dimension). This dimensional change allows the device to be flattened, reducing thickness while maintaining structural integrity and heat dissipation effectiveness.
2Device complexity
If semiconductor laser devices are in contact with the support member only on their bottom surfaces, then the mounting structure is simple, but heat dissipation is limited
Solution Approach 1:
The heat conducting members extend vertically upward from the bottom surface, creating a three-dimensional heat dissipation pathway. This allows heat to be conducted not only horizontally across the support member but also vertically through the heat conducting members to heat radiation portions, significantly improving heat dissipation capacity.
Solution Approach 2:
The support member is divided into functional zones: a first surface portion for electrical terminal contact and a second surface portion for heat conducting member contact. This segmentation allows optimized functionality for each zone, with the second surface portion specifically designed for thermal management through heat conducting members.
3Volume of moving object
If the device is downsized, then the device compactness is improved, but heat radiation capability may be reduced
Solution Approach 1:
The heat radiation portions are positioned at the top surface, utilizing the vertical dimension for heat radiation. This allows the main body of the device to be compact in the horizontal plane while maintaining effective heat radiation capability through the vertically extended heat conducting members and heat radiation portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables downsizing of the light source device while enhancing its heat radiation properties, improving cooling efficiency and preventing overheating.
Implementation Method 1
at least one heat conducting member... Each of the at least one heat conducting member is in contact with corresponding one of the at least one second surface portion
Implementation Method 2
enhancing heat radiation property... improving cooling efficiency
Data Source
AI summary
A light source device includes a plurality of light sources each comprising a semiconductor laser device, a mounting body to which the plurality of light sources is attached, and at least one heat conducting member. The mounting body has a front surface to be a light emitting side and a rear surface opposite to the front surface. The rear surface has at least one first surface portion. Terminals of at least one of the plurality of light sources protrude from each of the at least one first surface portion. The rear surface has at least one second surface portion which is closer to the front surface than any one of the at least one first surface portion. Each of the at least one heat conducting member is in contact with corresponding one of the at least one second surface portion.