Light Source Device Using Organic Adhesive Bonding
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Solution Overview
Problem
Existing light source devices for projectors have complex configurations and cumbersome manufacturing processes, which complicate the use of laser sources with wide color gamut and high efficiency.
Innovation Solution
A light source device with a simplified configuration, featuring a substrate, light emitting elements, a frame body, and a lid body with a light transmissive member, where the substrate and frame body are bonded using organic adhesives to create a housing space, and the lid body is bonded to the frame body using metal or organic adhesives, reducing the complexity and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional light source device configuration is used, then the device structure is complete and functional, but the configuration becomes complicated and manufacturing process becomes cumbersome
Solution Approach 1:
The patent combines the substrate and frame body into a single integrated component. The frame body includes a mounting surface for light emitting elements and forms a housing space with the substrate, eliminating the need for separate mounting structures and simplifying the overall device configuration while maintaining complete functionality.
Solution Approach 2:
The frame body serves multiple functions: it provides structural support, forms the housing space with the substrate, and includes mounting surfaces for light emitting elements. This multi-functional design reduces the number of separate components needed, thereby simplifying the device configuration without compromising reliability.
2Strength
If conventional bonding methods are used, then strong bonding is achieved, but heating temperature is high causing thermal stress
Solution Approach 1:
The patent changes the bonding parameter from high-temperature metal bonding to low-temperature organic adhesive bonding. This parameter change reduces the heating temperature during bonding, thereby minimizing thermal stress on the light emitting elements while still achieving sufficient bonding strength through the organic adhesive material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the device configuration, enhances productivity, reduces manufacturing costs, and improves the reliability of the light source device by using organic adhesives to lower heating temperatures and reduce thermal stress, while maintaining high efficiency and color gamut performance.
Implementation Method 1
at least one of a first bonding section with which the substrate and the frame body are bonded to each other, and a second bonding section with which the frame body and the lid body are bonded to each other includes an organic adhesive
Data Source
AI summary
A light source device according to the present disclosure includes a substrate having a first surface, a plurality of light emitting elements disposed on the first surface side of the substrate, a frame body which is disposed so as to surround the plurality of light emitting elements, and which is bonded on the first surface side of the substrate, and a lid body which has a light transmissive member, which is disposed so as to be opposed to the first surface of the substrate, and which is bonded on an opposite side of the frame body to the substrate. At least one of a first bonding section with which the substrate and the frame body are bonded to each other, and a second bonding section with which the frame body and the lid body are bonded to each other includes an organic adhesive.