Multi-Heat-Sink Light Source Cooling for Mixed Junction Temperatures

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing light source devices with multiple light emitting elements face challenges in efficiently managing thermal connections and heat dissipation, leading to increased radiator volume and manufacturing costs.

Innovation Solution

The light source device employs a configuration where light emitting elements with different maximum junction temperatures are thermally connected to separate heat sinks, optimizing heat resistance and reducing radiator volume by connecting elements with similar temperatures to shared heat sinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If all light emitting elements are thermally connected to the same heat sink, then the device structure is simplified, but the radiator volume increases and heat dissipation efficiency decreases

Engineering Contradiction:

Improveheat sink configurationVSAvoidradiator volume

Core Design Contradiction:

Device complexityVSVolume of stationary object

Solution Approach 1:

The patent divides the heat dissipation system into multiple heat sinks (first heat sink and second heat sink) based on the different maximum junction temperatures of light emitting elements. Elements with lower maximum junction temperatures are connected to the first heat sink, while elements with higher maximum junction temperatures are connected to the second heat sink. This segmentation allows for optimized heat resistance matching and reduces the overall radiator volume compared to a single large heat sink.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If light emitting elements with different maximum junction temperatures are connected to the same heat sink, then manufacturing is simplified, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improvethermal connection configurationVSAvoidheat dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies different heat sink configurations to different groups of light emitting elements based on their specific thermal characteristics. The first heat sink is designed with heat resistance optimized for elements with lower maximum junction temperatures, while the second heat sink is designed with heat resistance optimized for elements with higher maximum junction temperatures. This local optimization ensures each element operates within its optimal temperature range, improving overall heat dissipation efficiency.

Inventive Principle:

Principle #3Local quality

3Volume of moving object

If a single heat sink is used for all light emitting elements, then device size is reduced, but manufacturing cost increases

Engineering Contradiction:

Improvedevice sizeVSAvoidmanufacturing cost

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

By segmenting the heat sink system into multiple smaller heat sinks with optimized heat resistance values, the patent achieves better thermal management efficiency. This segmentation allows for more precise heat dissipation control, which can reduce material waste and improve manufacturing efficiency, thereby reducing overall manufacturing costs despite the increased number of components.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables downsizing of the light source device, reduces manufacturing costs, and facilitates efficient heat dissipation, while maintaining effective cooling.

Implementation Method 1

a first light emitting element having a maximum junction temperature at a first temperature; a second light emitting element having a maximum junction temperature at a second temperature higher than the first temperature; a third light emitting element having a maximum junction temperature at a third temperature equal to or higher than the second temperature

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a first heat sink to which the first light emitting element is thermally connected; and a second heat sink to which the third light emitting element is thermally connected

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

The second light emitting element is thermally connected to a heat sink shared with a light emitting element that is one of the first light emitting element and the third light emitting element

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20250354683A1Light source device and cooling unit

Publication Date: 2025.11.20 OLYMPUS MEDICAL SYST CORP

AI summary

A light source device includes: a first light emitting element having a maximum junction temperature at a first temperature; a second light emitting element having a maximum junction temperature at a second temperature higher than the first temperature; a third light emitting element having a maximum junction temperature at a third temperature equal to or higher than the second temperature; a first heat sink to which the first light emitting element is thermally connected; and a second heat sink to which the third light emitting element is thermally connected.