Thermal Conductive Light Source Holding Member for Laser Diode Cooling
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Solution Overview
Problem
Semiconductor light sources, such as laser diodes, experience decreased light emission efficiency and shortened lifespan due to increased temperature as their power increases, necessitating improved cooling performance to enhance heat radiation efficiency and extend light source life.
Innovation Solution
A light source apparatus featuring a semiconductor light source mounted on a thermal conductive material holding member, with a thermal conductive elastic member sandwiched between the holding members to efficiently conduct heat away from the light-emitting portion, utilizing a thermal conductive material like silicone with inorganic particles for high heat radiation performance and elasticity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor light source power is increased, then light emission efficiency improves, but temperature increases causing decreased efficiency and shortened lifespan
Solution Approach 1:
The patent applies local quality by providing thermal conductive members specifically at the light-emitting portion and power supply terminal areas where heat is most concentrated. The light source holding member is made of thermal conductive material with thermal conductivity of 1 W/(m·K) or more, and additional thermal conductive members are placed locally to create high-density heat dissipation paths exactly where needed, rather than uniformly distributing thermal management throughout the entire structure.
Solution Approach 2:
The patent employs composite materials by combining thermal conductive material (with thermal conductivity of 1 W/(m·K) or more) with elastic properties in the light source holding member. This composite structure provides both effective heat conduction and mechanical compliance to accommodate the semiconductor light source while maintaining optimal thermal contact.
2Duration of action of stationary object
If cooling performance is improved to reduce temperature, then light source lifespan is extended, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the light source holding member by making it both a mechanical support structure and a thermal management component. The holding member simultaneously holds the semiconductor light source in position and conducts heat away from it, eliminating the need for separate cooling apparatus and reducing overall device complexity while extending light source lifespan through effective thermal management.
Solution Approach 2:
The light source holding member made of thermal conductive material provides self-service cooling by passively conducting heat away from the semiconductor light source through its inherent thermal conductivity. The elastic material itself performs the cooling function without requiring external active cooling systems, thereby extending light source lifespan while maintaining simple device architecture.
3Loss of energy
If thermal conductive material is used in light source holding member, then heat radiation efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies dynamics by using elastic material for the light source holding member that can dynamically adapt to dimensional variations and assembly tolerances. The elastic material deforms to maintain optimal contact pressure and thermal contact between the semiconductor light source and the holding member, compensating for manufacturing precision variations while maintaining high heat radiation efficiency.
Solution Approach 2:
The patent utilizes parameter changes by selecting thermal conductive material with specific properties (thermal conductivity of 1 W/(m·K) or more, elastic characteristics) that allow the holding member to change its physical state and adapt to assembly variations. The elastic material's ability to change shape and maintain contact pressure compensates for manufacturing tolerances, achieving both good thermal contact and relaxed precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses temperature increases and prevents damage to fragile light-emitting surfaces, improving heat radiation efficiency and the reliability of the light source apparatus by efficiently removing heat and preventing dust accumulation, thereby extending the lifespan of semiconductor light sources.
Implementation Method 1
a thermal conductive member having a hole that houses a light-emitting portion of the semiconductor light source. The thermal conductive member is sandwiched between the light source holding member and the optical lens holding member, and comes into close contact with a side surface of the light-emitting portion
Implementation Method 2
a cooling member that radiates heat generated by the semiconductor light source through the light source holding member
Data Source
AI summary
A light source apparatus of the present disclosure includes a semiconductor light source, a light source holding member on which the semiconductor light source is disposed, the light source holding member being made of a thermal conductive material, and a cooling member that radiates heat generated by the semiconductor light source through the light source holding member. In addition, the light source apparatus includes an optical lens, an optical lens holding member that holds the optical lens and that is disposed on a light-emitting portion side of the semiconductor light source, and a thermal conductive member having a hole that houses a light-emitting portion of the semiconductor light source. The thermal conductive member is sandwiched between the light source holding member and the optical lens holding member, and comes into close contact with a side surface of the light-emitting portion.