Light Source Manufacturing for Position Measuring Devices
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Solution Overview
Problem
Existing position measuring devices face challenges in producing high-quality light sources economically and ensuring precise position measurements.
Innovation Solution
A method for producing a light source for position measuring devices involves attaching semiconductor components to an electrically conductive carrier body, then to an auxiliary carrier, and connecting them with a metal body using bonding wire connections, with a potting compound for encapsulation, allowing for reliable and precise position measurements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor components are attached to an electrically conductive carrier body and connected using bonding wire connections with encapsulation, then the reliability and quality of light sources are improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The manufacturing process is divided into distinct modular steps: providing semiconductor components, attaching them to carrier bodies, creating bonding wire connections, applying encapsulation layers, and producing test pads. Each step can be independently optimized and controlled, improving reliability while managing complexity through systematic segmentation of the manufacturing workflow.
Solution Approach 2:
The method performs preliminary actions by first attaching semiconductor components to carrier bodies and establishing bonding wire connections before final encapsulation. Test pads are produced in advance to enable preliminary electrical testing. This preliminary arrangement ensures proper positioning and electrical connectivity before the components are permanently encapsulated, improving light source quality through pre-verification.
2Measurement precision
If multiple manufacturing steps including bonding wire connections and encapsulation are performed, then measurement precision is improved, but productivity decreases
Solution Approach 1:
Multiple manufacturing operations are merged into an integrated process: semiconductor components are attached to carrier bodies, bonding wire connections are established, and encapsulation is applied in a unified manufacturing flow. Test pads are produced as part of the same process. This merging allows for batch processing and coordinated optimization of all steps, improving measurement precision through consistent integration while mitigating productivity loss through efficient process coordination.
3Reliability
If bonding wire connections are produced between electrically conductive bodies and carrier bodies, then electrical connectivity and reliability are improved, but manufacturing time and complexity increase
Solution Approach 1:
The bonding wire connection serves as an intermediary element that establishes electrical connectivity between the electrically conductive bodies and carrier bodies. This intermediary approach allows for flexible and reliable electrical connections that can be precisely controlled, improving reliability while enabling automated wire bonding processes that reduce manual manufacturing time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of high-quality light sources that facilitate precise position measurements in position measuring devices, ensuring reliable operation and cost-effectiveness.
Implementation Method 1
at least one semiconductor component is first provided which is designed such that light can be emitted by this when an electric current is introduced
Implementation Method 2
a bonding wire connection is then produced between the electrically conductive body and the carrier body, so that they are electrically connected to one another
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
The invention relates to a method for manufacturing a light source (1) for a sensor unit of a position measuring device, comprising the following steps: Attaching a semiconductor device (1.1) to a first auxiliary carrier (4), wherein, before or after attaching the semiconductor device (1.1) to the first auxiliary carrier (4), an electrically conductive carrier body (1.3) is attached to the at least one semiconductor device (1.1), so that a first assembly (100) is formed, which includes the at least one semiconductor device (1.1) and the carrier body (1.3). Attaching an electrically conductive body (1.4) to the first auxiliary carrier (4). Establishing a bond wire connection (1.6) between the electrically conductive body (1.4) and the carrier body (1.3). Applying a first potting compound (1.5) so that the carrier body (1.3) and the electrically conductive body (1.4) are fixed relative to each other by the first potting compound (1.5), forming a panel (P).Removal of the first auxiliary support (4). Fabrication of a first test pad electrically contacted with the first assembly. Fabrication of a second test pad (1.922) electrically contacted with the electrically conductive body (1.4). Passing an electric current through the first test pad (1.822) and the second test pad (1.922) to perform a temporary operation in which the semiconductor device (1.1) emits light. Subsequent separation of the panel (P), whereby the first and/or the second test pad (1.822, 1.922) is at least partially separated from the light source (1).