Light Source Device Metal Shielding for Signal Stability
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Solution Overview
Problem
Conventional light source devices in the TO-CAN package structure have not evolved to meet various requirements, leading to instability due to external signal interference and inadequate design for modern applications.
Innovation Solution
A light source device with electronic components arranged within a metal shield to prevent external signal interference, integrated design with a driver chip embedded in the board to reduce size and inductance, and a uplift block for adjustable height and enhanced heat dissipation, along with a cover plate for protection and cost-effective detection circuit formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional TO-CAN package structure is used, then device simplicity is maintained, but stability deteriorates due to external signal interference
Solution Approach 1:
The patent applies the Faraday cage principle to convert the harmful external electromagnetic signals into a beneficial shielding effect. The metal shield surrounding the electronic components reflects and absorbs external electromagnetic interference, transforming the harmful environmental factor into a protective mechanism that enhances operational stability.
Solution Approach 2:
The metal shield acts as an intermediary element between the external electromagnetic environment and the sensitive electronic components. This intermediate structure blocks harmful external signals from directly reaching the electronic components, thereby maintaining system stability without requiring changes to the components themselves.
2Volume of moving object
If driver chip is embedded in the board, then device size and inductance are reduced, but manufacturing complexity increases
Solution Approach 1:
The driver chip is merged with the circuit board by embedding it directly into the board structure. This integration combines previously separate components (driver chip and board) into a unified structure, reducing overall device volume and inductance while maintaining functional performance.
Solution Approach 2:
The driver chip is nested within the circuit board structure, similar to a nested doll configuration. This nesting approach allows the driver chip to be housed within the board's internal space, minimizing external dimensions and reducing parasitic inductance while keeping the manufacturing process manageable through standardized embedding techniques.
3Reliability
If metal shield surrounds electronic components, then stability is improved by preventing interference, but device complexity increases
Solution Approach 1:
The metal shield structure serves multiple functions simultaneously: it provides electromagnetic shielding to block external interference, acts as a structural support element, and can function as a heat dissipation path. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity while achieving improved operational stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more stable operation by shielding electronic components from external signals, reduces size and inductance, and enhances heat dissipation, while also protecting and cost-effectively forming detection circuits.
Implementation Method 1
The light source device in the present disclosure is formed with the electronic components arranged in the metal shield (i.e., the metal shield surrounds the outer side of the electronic components), so that the metal shield can be used to effectively prevent the electronic components from being interfered by external signals
Data Source
AI summary
A light source device includes a substrate, a light emitting unit, a frame, a light permeable member, and a metal shield. An upper electrode layer and a lower electrode layer of the substrate are respectively disposed on two opposite sides of the substrate, and are electrically coupled to each other. The light emitting unit is disposed on the upper electrode layer. The frame is disposed on the substrate and is arranged around the light emitting unit. The light permeable member is disposed on the frame and covers the light emitting unit. The metal shield is fixed to an inner side of the frame and is connected to the ground pad of the upper electrode layer. The metal shield is arranged around the outer side of the light emitting unit.