Light Source Module With Dam Structures For High Intensity Backlight
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Solution Overview
Problem
Edge-type backlight units (BLUs) face challenges in achieving high light intensity due to the limited number of light-emitting device packages that can be accommodated, which restricts the realization of ultra-slim display apparatuses with high light intensity.
Innovation Solution
A light source module design featuring a base plate with dam structures on either side, allowing for increased spacing and mounting of light-emitting devices with an encapsulation layer, which reduces the orientation angle of emitted light and enables a higher density of devices, thereby enhancing light intensity without the need for a lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the number of light-emitting device packages is increased to achieve high light intensity, then the light intensity is improved, but the thickness and complexity of the backlight unit increases
Solution Approach 1:
The light source is divided into multiple individual light-emitting devices mounted separately on the PCB substrate, rather than using traditional light-emitting device packages. This segmentation allows each device to be positioned independently with optimized spacing, increasing the total number of light sources without proportionally increasing overall thickness.
Solution Approach 2:
The light-emitting devices are arranged in a distributed pattern across the PCB substrate plane, utilizing two-dimensional space more effectively. The devices are positioned at different locations including corner regions, maximizing light output within the available area without requiring additional vertical thickness.
2Illumination intensity
If light-emitting devices are mounted closer together to increase density, then the light intensity is improved, but the manufacturing precision and reliability decrease
Solution Approach 1:
Mounting holes are pre-formed on the PCB substrate at precisely calculated positions before the light-emitting devices are installed. This preliminary preparation ensures accurate spacing and positioning of each device, maintaining manufacturing precision even when devices are mounted closer together to increase density.
3Length of moving object
If the orientation angle of light-emitting devices is reduced to improve light guide plate thickness, then the light guide plate thickness is reduced, but the light intensity output decreases
Solution Approach 1:
The light source is segmented into multiple individual devices distributed across the PCB, allowing each device to be oriented at an optimized angle. This segmentation enables the use of smaller orientation angles (reducing light guide plate thickness) while compensating for the reduced per-device light output by increasing the total number of light-emitting devices.
Solution Approach 2:
The orientation angle parameter of the light-emitting devices is changed to a smaller value, which directly reduces the required light guide plate thickness. This parameter change is compensated by increasing the number of light-emitting devices and optimizing their spatial distribution to maintain overall light intensity.
Data Source
AI summary
Provided are a light source module and a backlight unit (BLU) including the same. The light source module includes a substrate including a base plate extending in a first direction and a pair of dam structures stacked on opposing sides of the base plate along a second direction, orthogonal to the first direction, and extending along the base plate in the first direction, wherein the pair of dam structures are spaced apart from each other along a third direction, orthogonal to the first and second directions. A plurality of light-emitting devices are mounted on the substrate between the pair of dam structures and spaced apart from one another in the first direction. An encapsulation layer covers at least one side surface and a top surface of each of the plurality of light-emitting devices. A height of the pair of dam structures is greater than a height of the encapsulation layer.