Light Source Module Packing Layer for Fresnel Loss Reduction
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Solution Overview
Problem
Existing LED light source modules face limitations in light emission efficiency due to optical transmittance suppression by materials and Fresnel losses at air-material interfaces, and they require additional components and complex assembly for water-proofing.
Innovation Solution
A light source module design that includes a substrate, LED package, and an optical cover with a packing layer filled between them, where the refractive indices of the encapsulant, packing layer, and optical cover are optimized to minimize refractive index differences, eliminating the air gap and using diffuser particles or phosphors to enhance light homogenization and water-proofing without screws.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If an air layer is disposed between the LED package and the optical cover, then the assembly is simple, but the light emission efficiency is reduced due to Fresnel loss at air-material interfaces
Solution Approach 1:
The invention extracts and removes the air layer between the LED package and optical cover by introducing a packing layer that fills the gap. This eliminates the air-material interface and associated Fresnel loss, directly improving light emission efficiency without significantly complicating the assembly structure.
Solution Approach 2:
The packing layer serves as an intermediary substance between the LED package and optical cover. It has refractive index characteristics that reduce the refractive index difference at interfaces, thereby reducing Fresnel loss and improving light transmission efficiency while maintaining structural integrity.
2Reliability
If additional water-proofing silicone layer and screws are added, then the water-proofing effect is achieved, but the device complexity and assembly work are increased
Solution Approach 1:
The invention merges the water-proofing function with the existing packing layer structure. The packing layer itself is designed to provide water-proofing, eliminating the need for separate water-proofing silicone layers and screws, thereby reducing component count and assembly complexity while maintaining reliable water-proofing.
Solution Approach 2:
The packing layer is designed to perform multiple functions simultaneously: it fills the gap between components, provides optical coupling to improve light transmission, and provides water-proofing. This multi-functionality eliminates the need for separate dedicated components for each function.
3Loss of energy
If the refractive index difference between materials is large, then the material selection is flexible, but the optical transmittance is suppressed due to Fresnel loss
Solution Approach 1:
The invention changes the refractive index parameter of the packing layer to be intermediate between the LED package and optical cover materials. This parameter optimization reduces the refractive index difference at interfaces, minimizing Fresnel loss and improving optical transmittance while maintaining reasonable material selection flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves light emission efficiency, reduces assembly complexity, and provides better lighting quality, water-proofing, and dust-proofing while eliminating the need for additional fixtures, and diffuser particles ensure a comfortable visual effect by homogenizing light.
Implementation Method 1
optical transmittance is suppressed by transmittance of the material itself and the Fresnel loss caused by an interface between air and the material
Implementation Method 2
Fresnel loss caused by an interface between air and the material
Implementation Method 3
if the diffuser particles are added in the packing layer, the light emitted by the LED package is homogenized
Implementation Method 4
the at least one packing layer comprises phosphors
Data Source
AI summary
A light source module including a substrate, an LED package, an optical cover, and at least one packing layer is provided. The LED package is disposed on the substrate and includes an encapsulant. The optical cover is disposed above the LED package. The at least one packing layer is filled between the LED package and the optical cover.