Light Source Module Heat Dissipation via Segmented Reflective Structure
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Solution Overview
Problem
Edge type backlight units face challenges in achieving a low profile structure due to poor heat dissipation of light emitting diode packages, limiting the use of highly efficient light emitting diode chips.
Innovation Solution
A light source module with a circuit board, a light emitting device mounted via flip-chip bonding or surface mount technology, and a reflective portion with a bonding member, allowing for efficient heat dissipation and a slim structure while enhancing external appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If a light emitting diode package is used in an edge type backlight unit, then power consumption is reduced and structure is simplified, but heat dissipation performance deteriorates
Solution Approach 1:
The light emitting diode package is divided into separate components: the light emitting diode chip is mounted on a circuit board, and the heat dissipation function is separated to a dedicated heat dissipation structure. This segmentation allows independent optimization of light emission and heat dissipation functions, resolving the contradiction between reduced power consumption and heat dissipation performance.
Solution Approach 2:
A heat dissipation structure is introduced as an intermediary component between the light emitting diode chip and the environment. This intermediary structure facilitates efficient heat transfer from the chip without interfering with the light emission function, thereby maintaining low power consumption while improving heat dissipation.
2Loss of energy
If highly efficient light emitting diode chips are used, then luminous efficacy is improved, but heat dissipation requirements increase making low profile structure difficult to achieve
Solution Approach 1:
The heat dissipation path is extended in the lateral direction rather than increasing thickness. The heat dissipation structure extends horizontally from the circuit board, providing sufficient heat dissipation distance without increasing the vertical thickness of the backlight unit, thus enabling use of high-efficiency LEDs while maintaining a low profile structure.
3Length of stationary object
If the backlight unit thickness is reduced, then the display device becomes more compact, but heat dissipation capability is reduced
Solution Approach 1:
The heat dissipation structure is designed with non-uniform geometry, having different cross-sectional areas at different locations. The structure is wider at the base where heat is generated and tapers toward the end, concentrating heat dissipation capability at the critical location while maintaining overall compactness. This local optimization allows thin overall structure with sufficient heat dissipation at the heat source.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high efficiency and a slim structure for the backlight unit, reducing thickness and improving light distribution while minimizing light loss, thus enhancing the external appearance and luminous efficacy.
Implementation Method 1
a first light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT)
Implementation Method 2
a reflective portion disposed on the circuit board and having at least one recess accommodating the first light emitting device
Data Source
AI summary
A light source module including a circuit board, a first light emitting device mounted on the circuit board by flip-chip bonding or surface mount technology (SMT), a reflective portion disposed on the circuit board and having at least one recess accommodating the first light emitting device, and a bonding member disposed between the circuit board and the reflective portion. The reflective portion has a height greater than a height of the first light emitting device.