Quick-Assembly Light Source Module Snap-Fit Heat Dissipation

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Solution Overview

Problem

The existing assembly process of light source modules is complex, time-consuming, and often results in poor heat dissipation, which can lead to damage of high-power LEDs due to inadequate heat dissipation capabilities.

Innovation Solution

A quick-assembly light source module design featuring snap-fit elements on the optical portion and circuit board, allowing for a simplified assembly process with reduced steps and improved heat dissipation through strategically placed heat dissipation holes, ensuring efficient heat management and stability of the light source.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If traditional assembly process is used, then assembly is possible, but assembly process is complex and time-consuming

Engineering Contradiction:
Improveassembly efficiencyVSAvoidassembly process complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The optical portion is divided into modular components with separate first and second snap-fit elements, allowing independent assembly of circuit board and light source board. This segmentation enables parallel assembly operations and simplifies the overall assembly process while maintaining structural integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The snap-fit elements integrate multiple functions: mechanical connection, positioning, and heat dissipation guidance. The first snap-fit element simultaneously connects the circuit board to the optical portion and provides a mounting structure for the light source board, reducing the number of separate assembly steps.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If traditional assembly process is used, then assembly is possible, but heat dissipation is poor

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

Heat dissipation holes are strategically positioned at specific locations on the circuit board and optical portion to maximize thermal transfer efficiency. The snap-fit elements are designed with specific geometric features that create thermal pathways, concentrating heat dissipation capabilities at critical locations rather than distributing them uniformly.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The light source board is nested between the optical portion and circuit board, with the first snap-fit element passing through the light source board. This nested structure creates multiple thermal contact interfaces and pathways, enhancing heat dissipation through layered thermal conduction while maintaining a compact overall structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a more efficient assembly process with improved heat dissipation, reducing the risk of LED damage and allowing for the production of higher-power light source modules with enhanced reliability and efficiency.

Implementation Method 1

an edge or a light incident surface of the optical portion is provided with at least two first snap-fit elements which are arranged along a circumferential direction of the optical portion and are protruded towards an orientated direction of the light incident surface, a side portion of each of the first snap-fit elements is provided with a circuit board slot which is inwardly concaved from an external surface of the first snap-fit element; the circuit board is provided with a first snap-fit hole; the first snap-fit element is inserted into the first snap-fit hole, and the circuit board is clamped into the circuit board slot

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS11339952B2Quick-assembly light source module and lamp
Publication Date: 2022.05.24 OPPLE LIGHTING CO LTD
  • US11339952B2 patent drawing
  • US11339952B2 patent drawing
  • US11339952B2 patent drawing

AI summary

The present disclosure discloses a quick-assembly light source module, a lighting device and a method of manufacturing a quick-assembly light source module. The quick-assembly light source module includes: an optical portion, a light source board and a circuit board; an edge or a light incident surface of the optical portion is provided with at least two first snap-fit elements, and a side portion of each of the first snap-fit elements is provided with a circuit board slot; the circuit board is provided with a first snap-fit hole; the first snap-fit element is inserted into the first snap-fit hole, and the circuit board is clamped into the circuit board slot, the light source board is disposed between the optical portion and the circuit board, and a surface of the light source board facing towards the light incident surface of the optical portion is provided with a light source.