Light Source Module Thermal Management via Pressed Circuit Board
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Solution Overview
Problem
The downsizing of light source modules for vehicle lamps reduces the contact area between the circuit board and the mounting base, making it difficult to effectively release heat generated by semiconductor light emitting devices.
Innovation Solution
Incorporating a power feeding attachment with an electrically-insulating portion made of high thermal conductivity material and a conductive portion embedded within, which presses the circuit board against the mounting base, enhancing heat dissipation through both the insulating and conductive materials, and utilizing a concave portion to increase surface area for air dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit board is downsized to reduce the size of the vehicle lamp, then the size of the light source module is reduced, but the contact area between the mounting base and the back surface of the circuit board is reduced, making it difficult to effectively release heat
Solution Approach 1:
The power feeding attachment is divided into functionally distinct portions: an electrically-insulating portion for thermal conduction and pressing, and a conductive portion for electrical power delivery. This segmentation allows each portion to be optimized for its specific function, with the insulating portion dedicated to heat dissipation and the conductive portion to power supply, resolving the contradiction between downsizing and heat release.
Solution Approach 2:
The electrically-insulating portion of the power feeding attachment serves multiple functions simultaneously: it provides electrical insulation, conducts heat away from the circuit board, and applies pressing force to maintain thermal contact. This multi-functionality allows the structure to address both size reduction and heat release requirements without adding separate components.
2Area of stationary object
If the contact area between the circuit board and mounting base is reduced due to downsizing, then the light source module becomes more compact, but the ability to release heat generated by the semiconductor light emitting device is compromised
Solution Approach 1:
The electrically-insulating portion of the power feeding attachment acts as an intermediary thermal conduction path between the circuit board and the mounting base. It provides a dedicated thermal conduction route that compensates for the reduced direct contact area, ensuring efficient heat transfer from the semiconductor device to the heat sink without requiring a larger contact area.
Solution Approach 2:
The power feeding attachment combines materials with different properties: an electrically-insulating material with high thermal conductivity for the thermal management portion, and a conductive material for the electrical connection portion. This composite structure enables simultaneous optimization of electrical insulation, thermal conduction, and mechanical pressing functions, resolving the contradiction between reduced contact area and maintained heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for effective heat release from the semiconductor light emitting devices even with a smaller circuit board, maintaining heat release performance while enabling further downsizing of the light source module.
Implementation Method 1
an electrically-insulating portion formed of an electrically-insulating material having a higher thermal conductivity than the board part
Implementation Method 2
the electrically-insulating portion presses at least a portion of the circuit board against the mounting base
Implementation Method 3
a semiconductor light emitting device such as an LED as a light source
Data Source
AI summary
The light source module includes a circuit board adapted to be placed on a mounting base of a light source holding member, and a power feeding attachment to supply power to a semiconductor light emitting device, the circuit board including a board part on which the semiconductor light emitting device is mounted, and a conductive circuit formed on a surface of the board part and having a pair of terminal parts and a light source connection part to connect the pair of terminal parts and the semiconductor light emitting device, the power feeding attachment including an electrically-insulating portion and an conductive portion partially embedded in the electrically-insulating portion, the power feeding attachment being adapted to be attached to the light source holding member such that the electrically-insulating portion presses at least a portion of the circuit board against the mounting base.