Surface-Emitting Light Source With Penetrating Adhesive Gaps
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Solution Overview
Problem
Conventional surface-emitting light sources lack sufficient drop impact resistance due to the lack of effective structural features that absorb or distribute impact forces.
Innovation Solution
A surface-emitting light source design that includes light-emitting modules arranged with spaces between them, bonded to a wiring board using a thermosetting resin adhesive, where the adhesive forms a penetrating portion with a gap detached from the lateral surfaces of the modules, enhancing impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If light-emitting modules are bonded closely together on the wiring board, then the device density is improved, but the drop impact resistance deteriorates due to lack of space for adhesive penetration and strain absorption
Solution Approach 1:
The adhesive is nested into the spaces between adjacent light-emitting modules, forming penetrating portions that extend into the gaps. This allows the adhesive to be positioned within the available space rather than only at the interfaces, maximizing bonding effectiveness while maintaining module spacing for impact resistance.
Solution Approach 2:
The adhesive bonding transitions from a two-dimensional interface bonding to a three-dimensional structure by penetrating into the spaces between modules. The adhesive forms vertical columns or portions that extend into the gap space, adding a depth dimension to the bonding structure that enhances both attachment strength and impact absorption.
2Strength
If adhesive is applied to bond light-emitting modules to the wiring board, then the bonding strength is improved, but the strain absorption during impact deteriorates due to rigid bonding
Solution Approach 1:
The adhesive structure parameters are changed by controlling its penetration depth and forming gaps at the lateral surfaces. The adhesive maintains strong bonding at the wiring board interface while creating a compressed air gap structure at the module interfaces, transforming the bonding configuration to balance strength and strain absorption.
Solution Approach 2:
The bonding structure becomes a composite of adhesive material and compressed air (gaps). This composite structure combines the strong bonding properties of the thermosetting resin with the strain-absorbing properties of the air gaps, achieving both bonding strength and impact resistance.
3Reliability
If spaces are left between adjacent light-emitting modules, then the drop impact resistance is improved through strain absorption, but the device density deteriorates
Solution Approach 1:
The adhesive is nested into the necessary spaces between modules, utilizing the gap volume for bonding purposes. This allows the spaces to serve dual functions: providing strain absorption capacity for impact resistance and serving as the medium for adhesive penetration to maintain bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly improves drop impact resistance by reducing strain and deformation through the absorption of impact forces by the penetrating portion and gap, thereby minimizing breakage and luminance non-uniformity.
Implementation Method 1
The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules
Implementation Method 2
applying heat and pressure to the adhesive to bond the wiring board to the plurality of light-emitting modules by melting and curing the adhesive
Implementation Method 3
applying heat and pressure to the adhesive to bond the wiring board to the plurality of light-emitting modules by melting and curing the adhesive
Data Source
AI summary
A surface-emitting light source includes a plurality of light-emitting modules each including an array of a plurality of light sources and a wiring board disposed on an array of the plurality of light-emitting modules with an adhesive interposed therebetween. The plurality of light-emitting modules to be disposed on the wiring board are arranged such that a space is left between adjacent ones of the light-emitting modules. The adhesive contains a thermosetting resin and includes a penetrating portion inside the space. The penetrating portion includes a gap detached from a lateral surface of the light-emitting modules.