Light Source Unit Positioning Structure for THAMR Bonding

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional thermally-assisted magnetic heads face issues with unstable light source positioning, solder overflow, and electrical shorts due to the bonding process, which affect the performance and stability of the magnetic recording process.

Innovation Solution

A light source unit with a positioning structure, such as spacers or cavities, is integrated between the support member and the light source to maintain stable height control and prevent solder overflow during bonding, ensuring the light source remains positioned correctly and preventing electrical shorts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the light source is bonded to the support member using solder without a positioning structure, then the bonding process is simple, but the light source position becomes unstable and solder may overflow

Engineering Contradiction:

Improvebonding process simplicityVSAvoidlight source position stability

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

A positioning structure is formed on the support member before the light source is bonded to it. This positioning structure pre-establishes the correct spatial relationship between the light source and support member, ensuring accurate positioning during the subsequent bonding process without requiring complex bonding procedures

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The positioning structure acts as an intermediary element between the light source and the support member. It provides a predefined interface that guides the light source into the correct position and maintains stability during bonding, preventing both position instability and solder overflow

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If the light source is bonded without a positioning structure, then the structure is simpler, but solder may overflow causing electrical shorts

Engineering Contradiction:

Improvelight source unit structureVSAvoidelectrical short prevention

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The positioning structure is formed in advance on the support member to define the bonding area boundaries. This preliminary structure prevents solder from overflowing during the bonding process by providing physical constraints, thereby preventing electrical shorts without significantly increasing device complexity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The positioning structure serves as an intermediary that mediates between the solder and the support member. It confines the solder within the designated bonding area during the bonding process, preventing electrical shorts while maintaining a relatively simple overall structure

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If the light source is bonded without a positioning structure, then the bonding process is simpler, but the light source may shift during solder melting

Engineering Contradiction:

Improvebonding process simplicityVSAvoidlight source position stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The positioning structure is formed before the light source bonding process. It pre-establishes the correct position and provides physical constraints that prevent the light source from shifting during solder melting, maintaining position stability without complicating the bonding process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The positioning structure acts as an intermediary that stabilizes the light source position during the bonding process. It provides mechanical support and positioning constraints that prevent shifting while allowing the bonding process to proceed with simple solder application

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The positioning structure stabilizes the light source and solder during bonding, preventing overflow and ensuring consistent performance of the thermally-assisted magnetic head, thereby enhancing the reliability and stability of the magnetic recording process.

Implementation Method 1

the support member is heated to melt the solder

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

The light source 131 emits a laser light to a portion of the magnetic recording medium, which reduces the medium's coercivity

Methodology Applied

Scientific EffectLaser heating: Laser

Data Source

PatentUS10152992B1Light source unit and thermally-assisted magnetic head

Publication Date: 2018.12.11 SAE MAGNETICS (HK) LTD

AI summary

A light source unit for thermally-assisted magnetic head includes a support member and a light source attached on the support member via a solder, and the light source unit further includes a positioning structure formed between the support member and the light source for positioning the light source and the solder. The light source unit can maintain stable height control of the light source, prevent solder over flow and prevent the light source from shifting and moving during the bonding process.