Light Source Reflective Layer Positioning for Wide Distribution
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Solution Overview
Problem
Conventional light sources with reflective layers formed between or on semiconductor elements suffer from reduced light distribution angles due to limited surface area of the reflective layer, leading to increased light transmission above the semiconductor element and decreased emission to the sides.
Innovation Solution
A light source configuration featuring a semiconductor element with a substrate and a translucent sealing resin, where a reflective layer is disposed on the upper face of the sealing resin, allowing for a larger surface area and increased light reflection to the sides, thereby suppressing the decrease in light distribution angle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the reflective layer is formed between layers of the semiconductor element or on the surface of the sapphire substrate, then the manufacturing process is simplified, but the surface area of the reflective layer is limited and the light distribution angle decreases
Solution Approach 1:
The reflective layer is moved from the horizontal plane (between layers or on substrate surface) to the vertical dimension (on the upper face of the sealing resin). This dimensional change allows the reflective layer to extend beyond the semiconductor element's footprint while maintaining manufacturing simplicity, thereby increasing both surface area and light distribution angle without compromising ease of manufacture
2Device complexity
If the reflective layer is formed between layers of the semiconductor element, then the structure is compact, but the surface area of the reflective layer cannot exceed the semiconductor element surface area
Solution Approach 1:
By positioning the reflective layer on the upper face of the sealing resin rather than between layers, the design exploits the vertical space above the semiconductor element. This allows the reflective layer to have a larger surface area while maintaining structural compactness, as the reflective layer can extend laterally beyond the semiconductor element's boundaries without increasing the overall device footprint
3Ease of manufacture
If the reflective layer is formed on the sapphire substrate surface, then the alignment is simplified, but the proportion of light transmitted above the semiconductor element increases
Solution Approach 1:
The reflective layer is extracted from its conventional position on the sapphire substrate and relocated to the upper face of the sealing resin. This extraction allows the reflective layer to be positioned where it can effectively intercept and redirect light that would otherwise be transmitted above the semiconductor element, thereby reducing energy loss while maintaining alignment simplicity through the same coating processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the proportion of light emitted to the sides, widens the irradiation range, and reduces the impact of heat generation and material limitations, while facilitating easier formation of the reflective layer.
Implementation Method 1
a reflective layer that is disposed on an upper face of the sealing resin... the proportion of the light that is transmitted above the semiconductor element without being reflected by the reflective layer becomes larger... the proportion of the light emitted to the side of the light emitting element relative to the light emitted above the light emitting element becomes smaller
Data Source
AI summary
A light source includes a semiconductor element with a substrate, a translucent sealing resin that covers the semiconductor element, and a reflective layer that is disposed on an upper face of the sealing resin.