Light Source Apparatus Downsizing via Substrate Nesting
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Solution Overview
Problem
Existing electric light bulb type lighting apparatuses face challenges in downsizing due to the spatial constraints of their components, such as power source and drive circuits, which hinder their practical application.
Innovation Solution
The electric light bulb type light source apparatus incorporates a power source substrate with a through hole or cutout, allowing the drive substrate to be partially disposed within, along with a common substrate for the speaker drive and control circuits, and a support unit that separates the light source and speaker, optimizing component placement within a compact casing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If components including power source circuit and drive circuits are contained in the casing, then the lighting apparatus can be assembled, but the size of the apparatus becomes too large for realistic use
Solution Approach 1:
The drive substrate is disposed inside the through-hole of the power source substrate, creating a nested configuration where one component is placed within another. This nesting approach significantly reduces the overall volume occupied by these components while maintaining their functional integrity and electrical connections.
Solution Approach 2:
Instead of arranging components in a planar fashion on separate substrates, the invention utilizes the vertical dimension by creating a through-hole in the power source substrate and placing the drive substrate within this three-dimensional space. This dimensional transition from 2D to 3D arrangement enables compact integration.
2Volume of moving object
If multiple substrates (power source, drive, speaker drive) are provided separately, then each circuit can be independently designed, but the apparatus size increases
Solution Approach 1:
The speaker drive substrate and drive substrate are merged into a single common substrate, eliminating the need for separate substrates while maintaining independent circuit design capabilities. This consolidation reduces the number of components and the space they occupy without compromising manufacturing flexibility.
Solution Approach 2:
The common substrate serves multiple functions by accommodating both the drive circuit and speaker drive circuit on the same substrate. This multi-functional approach allows independent circuit designs to coexist while reducing overall component count and apparatus volume.
3Volume of moving object
If components are densely arranged to achieve downsizing, then apparatus size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The light source unit, which generates significant heat, is extracted from the immediate vicinity of the power source substrate and drive substrate by being supported at a distance. This spatial separation allows heat to dissipate more effectively while maintaining the compact overall structure of the apparatus.
Solution Approach 2:
The apparatus is segmented into distinct functional zones: the power source substrate with its through-hole, the drive substrate nested within, the light source unit supported separately, and the speaker positioned on the casing. This segmentation enables optimized heat management by separating heat-generating components from heat-sensitive components.
Data Source
AI summary
An electric light bulb type light source apparatus includes a light source unit, a power source substrate, a drive substrate, a base, and a casing. On the power source substrate, a power source circuit is mounted, and the power source substrate has one of a through hole and a cutout. On the drive substrate, a drive circuit of at least the light source unit is mounted, and the drive substrate includes a part disposed in the one of the through hole and the cutout of the power source substrate. The base is used to supply power to the power source substrate. The casing is configured to contain the light source unit, the power source substrate, and the drive substrate, and the casing has a translucent cover.