Light Source Substrate Sandwich Fixation for Heat Dissipation

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Solution Overview

Problem

Existing light source devices for display devices face issues with heat dissipation, particularly with point light sources like LEDs, where adhesives used to fix the light source substrate and heat-dissipating members can peel off over time, and the use of metal core printed-circuit boards increases costs.

Innovation Solution

A light source device design featuring a point light source mounted on a substrate with a cover and a support member that sandwiches the substrate, using through holes or notches for secure fixation and enhanced heat dissipation, allowing for easy replacement without wire breakage or damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesives are used to fix the light source substrate and heat-dissipating members, then the components can be assembled together, but the adhesive peels off over time reducing reliability

Engineering Contradiction:
Improveadhesive bonding durabilityVSAvoidservice life of adhesive bond
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent extracts the adhesive bonding method and replaces it with a mechanical interference fit system. The support member includes protrusions that engage with corresponding recesses in the light source substrate, and the heat-dissipating member includes protrusions that engage with recesses in the support member, creating a permanent mechanical connection that eliminates adhesive peeling over time.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The support member acts as an intermediary component between the light source substrate and the heat-dissipating member. It provides a mechanical interface with protrusions and recesses that securely connects both components, transferring heat from the light source substrate through the support member to the heat-dissipating member while eliminating the need for adhesive bonding.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If metal core printed-circuit boards are used to prevent adhesive peeling, then reliability improves, but manufacturing cost increases

Engineering Contradiction:
Improvesubstrate fixation stabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the fixation function from the substrate material itself. Instead of using an expensive metal core substrate, it uses a separate support member with protrusions that engage with recesses in the substrate. This allows the use of cost-effective FPC substrates while achieving reliable fixation through the mechanical interference fit system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The support member serves as an intermediary that provides the mechanical fixation function without requiring the substrate itself to be expensive. The protrusions and recesses mechanism allows standard FPC substrates to be used while achieving the same fixation reliability that would otherwise require metal core substrates.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Illumination intensity

If point light sources are used to enhance luminance, then display quality improves, but heat generation increases causing high temperature at the light source periphery

Engineering Contradiction:
Improveluminance of display screenVSAvoidtemperature at light source periphery
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by the point light source into a beneficial thermal management opportunity. The heat-dissipating member with its protrusions engaging the support member creates a dedicated thermal pathway that guides heat away from the light source periphery to a designated dissipation location, transforming the harmful thermal effect into a controlled heat dissipation process.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The support member with its protrusions acts as an intermediary thermal management structure. It provides both mechanical fixation and thermal conduction pathways, connecting the light source substrate to the heat-dissipating member through a structured interface that efficiently transfers heat from the high-temperature light source periphery to the heat-dissipating member.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design efficiently dissipates heat from the light source substrate while preventing adhesive peeling and reducing costs by securely fixing the substrate and support member, enabling reliable operation and easy replacement of the light source device.

Implementation Method 1

a support member for supporting the light source substrate, the support member arranged to be opposed to the reverse side of the mounting surface of the light source substrate

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS8727596B2Light source device and surface light source device equipped with same
Publication Date: 2014.05.20 TRIVALE TECHNOLOGIES LLC
  • US8727596B2 patent drawing
  • US8727596B2 patent drawing
  • US8727596B2 patent drawing

AI summary

A light source device comprising: a point light source for emitting light; a light source substrate directly mounting the point light source; a light source substrate cover having a through hole or a notch in a position to which the point light source corresponds, the light source substrate cover arranged opposite to a surface of the light source substrate on which the point light source is mounted; and a support member for supporting the light source substrate, the support member arranged to be opposed to the reverse side of the mounting surface of the light source substrate, the support member has a substantially same size with the light source substrate; wherein the light source substrate cover and the support member sandwich the light source substrate to support the light source substrate.