Vehicle Light Source Unit Heat Dissipation via Bending

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Solution Overview

Problem

Existing light source units for vehicles face challenges in achieving sufficient heat dissipation while also requiring miniaturization and weight reduction, as semiconductor light emitting elements generate significant heat and traditional materials like metals are not moldable or cost-effective.

Innovation Solution

A light source unit design combining an injection-molded socket with a heat dissipation member made from a higher thermal conductivity material, where the heat dissipation member is formed by bending to increase surface area and reduce volume, and includes projecting portions for enhanced rigidity and protection of heat radiation fins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a metal socket is used to dissipate heat, then heat dissipation performance is improved, but weight and cost increase

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidweight of light source unit
Core Design Contradiction:
TemperatureVSWeight of moving object

Solution Approach 1:

The light source unit is divided into two functional parts: an injection-molded resin socket for structural support and electrical connection, and a separate metal heat dissipation member for thermal management. This segmentation allows each component to be optimized for its specific function while using appropriate materials, resolving the contradiction between heat dissipation performance and weight.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The light source unit employs a composite structure combining resin (for the socket) and metal (for the heat dissipation member). This composite approach leverages the advantages of both materials: the moldability and cost-effectiveness of resin injection molding, and the superior thermal conductivity of metal, thereby achieving both weight reduction and effective heat dissipation.

Inventive Principle:
Principle #40Composite materials

2Temperature

If a metal socket is used to dissipate heat, then heat dissipation performance is improved, but manufacturing complexity and cost increase

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidmoldability and cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

By separating the socket and heat dissipation member into distinct components, the socket can be manufactured using injection molding of resin, which is highly automated and cost-effective. The metal heat dissipation member can be separately fabricated using appropriate metal forming processes. This segmentation resolves the contradiction by allowing each component to be manufactured using the most suitable and economical process for its function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The composite structure enables the socket to be made from injection-molded resin, which offers excellent moldability and cost advantages compared to metal machining or forming. The heat dissipation function is fulfilled by the separate metal member, which can be optimized for thermal performance independently. This resolves the contradiction between heat dissipation performance and ease of manufacture.

Inventive Principle:
Principle #40Composite materials

3Temperature

If the socket volume is increased to improve heat dissipation, then heat dissipation performance is improved, but the unit size increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidvolume of light source unit
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The use of a metal heat dissipation member with high thermal conductivity allows for a compact design. The metal material's superior thermal properties enable effective heat dissipation from a smaller volume compared to what would be required with resin alone. This resolves the contradiction by achieving the required heat dissipation performance in a compact form factor through material selection.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The heat dissipation member extends in multiple directions (first direction parallel to the socket surface, and second direction intersecting with the first direction) to maximize heat dissipation surface area within a compact volume. This multi-dimensional configuration allows efficient heat dissipation without increasing the overall unit size, resolving the contradiction between heat dissipation performance and compactness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively dissipates heat, reduces weight, and miniaturizes the unit while protecting it from external forces and environmental factors like water and dust, thus meeting demands for both heat dissipation and compact design.

Implementation Method 1

a heat dissipation member that has a second thermal conductivity being higher than the first thermal conductivity... Heat generated by the semiconductor light emitting element is guided (transferred) to the second portion via the first portion and dissipated efficiently

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the socket includes plural heat radiation fins that are arranged on the second side

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

the socket includes plural heat radiation fins that are arranged on the second side

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP2899455B1Light source unit
Publication Date: 2018.04.18 KOITO MFG CO LTD
  • EP2899455B1 patent drawingFigure 1A~1B
  • EP2899455B1 patent drawingFigure 2A~2B
  • EP2899455B1 patent drawingFigure 3

AI summary

A light source unit (1, 1A, 1B) includes a socket (10), a heat dissipation member (20, 20B), a board (30) and a semiconductor light emitting element (40). The socket (10) has a first thermal conductivity and includes a portion that defines a first side and a second side. The heat dissipation member (20, 20B) has a second thermal conductivity being higher than the first thermal conductivity. The board (30) is disposed on the first side. The semiconductor light emitting element (40) is supported by the board (30). The socket (10) is an injection-molded member. The heat dissipation member (20, 20B) includes a first portion (21) and a second portion (22, 23). The first portion (21) is disposed on the first side, extends in a first direction, and supports the board (30). The second portion (22, 23) includes a portion extending in a second direction intersecting with the first direction, as a result of being subjected to bending processing. A part (22a, 23a) of the second portion (22, 23) is disposed on the second side.