Multilayer Light Source Wiring for Laser Failure Management
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Solution Overview
Problem
The short lifespan and maintenance challenges of high-pressure mercury lamps in projection-image display apparatuses are addressed by using semiconductor laser light sources, but these sources face issues with open-mode failures when connected in series, leading to increased substrate size and complexity.
Innovation Solution
A light source device with a multilayer substrate structure and flexible printed circuits (FPCs) that electrically connect semiconductor lasers in series, incorporating detour paths and protrusions to manage current flow and reduce the impact of open-mode failures, allowing for parallel connection of series circuits to limit the number of failed lasers and maintain a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If semiconductor laser light sources are connected in series, then the lifespan is extended compared to high-pressure mercury lamps, but open-mode failures cause the entire series circuit to fail
Solution Approach 1:
The patent divides the series-connected semiconductor laser light sources into multiple groups, with each group having its own independent current supply path. This segmentation allows one group to continue operating even when another group experiences an open-mode failure, thereby maintaining system reliability while extending overall lifespan.
Solution Approach 2:
The patent changes the electrical connection parameter from a single series circuit to multiple parallel series circuits. By providing alternative current paths with different electrical parameters, the system can bypass failed components and maintain operation, resolving the reliability issue while preserving the extended lifespan benefit of semiconductor lasers.
2Reliability
If multiple current supply paths are provided to counteract open-mode failures, then reliability is improved, but the substrate size increases
Solution Approach 1:
The patent utilizes the vertical dimension of the substrate by forming wiring layers at different heights (first wiring layer and second wiring layer). This three-dimensional wiring arrangement allows multiple current supply paths to be packed into a compact area, improving reliability through redundant paths without significantly increasing the substrate's planar area.
Solution Approach 2:
The patent nests the wiring structures by placing one wiring layer within or alongside another wiring layer in the vertical direction. The first and second wiring layers are positioned at different heights and can overlap or adjacently nest, creating multiple current paths within a compact volume. This nesting approach provides redundancy while minimizing the overall substrate area required.
3Reliability
If wiring layers are added to provide alternative current paths, then open-mode failure resistance is improved, but device complexity increases
Solution Approach 1:
The patent designs the first and second wiring layers to serve dual functions: they provide alternative current supply paths for reliability, and they can be integrated with the existing substrate manufacturing process. The wiring layers use similar materials and fabrication techniques as single-layer substrates, reducing the added complexity while achieving multi-path current supply capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a small, efficient light source device that mitigates open-mode failures in semiconductor laser light sources, ensuring continued operation with minimal substrate size increase and improved heat management, thus extending the lifespan and reliability of the light source.
Implementation Method 1
a first wiring is disposed on a first layer of the substrate and a second wiring is disposed on a second layer of the substrate. The first wiring and the second wiring are electrically connected.
Implementation Method 2
a first light source including at least two light sources, a second light source including at least two light sources... in consideration of a countermeasure against a failure of any semiconductor laser light sources
Data Source
AI summary
The light source device includes a first light source, a second light source, and a substrate including a base member. A first wiring and a second wiring are disposed on the substrate. The first wiring has a connection part including connection parts such that the first light source is electrically connected in series and a connection part including connection parts such that the second light source is electrically connected in series. The base member is provided with at least one through-hole at each portion where the connection parts of the connection parts are disposed, and includes a protrusion in a vicinity of the through-hole such that the protrusion protrudes along a surface of the base member in a direction intersecting the first wiring. The second wiring includes at least one detour path in a vicinity of the protrusion, detouring around the through-hole with an insulation distance from the through-hole.